Flexible Substrate Lighting Device Eliminates Hot Spots
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Solution Overview
Problem
Conventional LED lighting devices using PCB boards suffer from reduced luminous efficiency due to the hot spot phenomenon and increased production costs associated with light-shielding patterns, which also require more raw materials and production processes.
Innovation Solution
A lighting device design featuring a reflective element layer, an optical resin layer, and a transparent electrode film layer with light-emitting units positioned opposite to the surface light source, eliminating the need for a PCB board and allowing for selective application of second reflective patterns to prevent hot spots and enhance luminous efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional PCB boards are used to mount LED light sources, then the structural support and electrical connection are provided, but the hot spot phenomenon occurs and luminous efficiency is reduced
Solution Approach 1:
The patent extracts and removes the PCB board from the lighting device structure, replacing it with a flexible substrate that integrates the LED mounting function without causing hot spots. This eliminates the harmful thermal accumulation effect while maintaining structural support and electrical connection capabilities.
Solution Approach 2:
The patent changes the physical and thermal parameters of the substrate material from rigid PCB to flexible material with improved thermal properties. This parameter change allows for better heat dissipation and eliminates the hot spot phenomenon, thereby improving luminous efficiency.
2Loss of energy
If light-shielding patterns are applied to prevent hot spots, then the hot spot phenomenon is reduced, but the production costs and number of raw materials increase
Solution Approach 1:
The patent removes the need for additional light-shielding patterns by fundamentally changing the substrate material properties. The flexible substrate inherently prevents hot spots through its thermal and optical characteristics, eliminating the need for separate shielding layers and reducing production complexity.
Solution Approach 2:
The flexible substrate serves multiple functions simultaneously: it provides structural support, electrical connection, and inherent hot spot prevention through its material properties. This multi-functionality eliminates the need for separate light-shielding patterns and reduces the overall number of components and production steps.
3Illumination intensity
If traditional surface light source configuration is used, then the light emission is achieved, but the hot spot phenomenon occurs and luminous efficiency is reduced
Solution Approach 1:
The patent inverts the traditional mounting configuration by positioning LED light sources on the lower surface of the flexible substrate rather than on the upper surface. This inverted arrangement changes the thermal and optical pathways, preventing hot spot formation while maintaining effective light emission through the substrate.
4Reliability
If PCB board is used for mounting, then the electrical connection is provided, but the number of raw materials and production processes increase
Solution Approach 1:
The patent merges the functions of structural support, electrical connection, and thermal management into a single flexible substrate component. This integration eliminates the need for separate PCB boards and reduces the total quantity of raw materials required while maintaining reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents the hot spot phenomenon, increases luminous efficiency, reduces raw material usage, and decreases production costs by eliminating the PCB board and optimizing the application of reflective patterns.
Implementation Method 1
a reflective element layer; an optical resin layer formed on the reflective element layer
Implementation Method 2
an optical resin layer formed on the reflective element layer
Implementation Method 3
a transparent electrode film layer formed on the optical resin layer
Data Source
AI summary
The present disclosure provides a lighting device comprising: a reflective element layer; an optical resin layer formed on the reflective element layer; a transparent electrode film layer formed on the optical resin layer; and a plurality of light-emitting units formed on the lower surface of the transparent electrode film layer. The lighting device allows the fundamental cause of the hot spot phenomenon to be eliminated, shows excellent luminous efficiency by efficiently performing the function of a surface light source, and enables the kinds of raw materials and the number of production processes to be reduced by eliminating the use of a PCB board and selectively applying second reflective patterns.