Flexible Substrate Antenna Module for Compact mmWave Arrays
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization of millimeter wave (mmWave) antenna modules is hindered by the large size required for high antenna performance, particularly in 5G communications, where high frequency demands are not met by existing designs.
Innovation Solution
An antenna module with a flexible substrate structure, featuring a first region with antennas and a second region that is flexibly bent and electrically connected to an integrated circuit (IC), along with a set substrate and module configuration, allowing for compact design and efficient signal transmission in the mmWave band.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large size antenna is used to achieve high antenna performance for millimeter wave communications, then antenna performance is improved, but the antenna module size increases which hinders miniaturization
Solution Approach 1:
The patent transitions from a planar antenna layout to a three-dimensional folded substrate structure. The substrate is bent and folded to create multiple layers and spatial dimensions, allowing the antenna elements to be arranged in a compact volume while maintaining the required effective area for millimeter wave operation. This dimensional transformation enables high antenna performance without increasing the overall module footprint.
Solution Approach 2:
The patent employs a nested arrangement where antenna elements and circuit components are integrated within the folded substrate structure. Multiple antenna elements are positioned at different levels and orientations within the same spatial envelope, effectively nesting functional elements to achieve high performance in a miniaturized package.
2Volume of moving object
If the substrate is made flexible to enable bending and folding for miniaturization, then device complexity is reduced and miniaturization is achieved, but manufacturing precision and structural stability may be compromised
Solution Approach 1:
The patent utilizes a flexible substrate made from thin film materials that can be bent and folded without compromising electrical performance. The flexible nature of the substrate allows it to conform to compact three-dimensional configurations while maintaining precise electrical connections through flexible printed circuit board (FPCB) technology, which ensures consistent trace geometry and impedance control even in bent states.
Solution Approach 2:
The substrate is designed with dynamic flexibility, allowing it to be manufactured in a flat state for precise assembly and then transformed into a compact folded configuration. The flexible substrate maintains structural integrity during bending while enabling precise positioning of antenna elements and circuit components through controlled folding patterns.
3Volume of moving object
If multiple antenna elements are arranged in a compact array to achieve miniaturization, then antenna module size is reduced, but signal interference and coupling between elements may increase
Solution Approach 1:
The patent arranges multiple antenna elements in three-dimensional space using the folded substrate structure. Elements are positioned at different heights, angles, and lateral positions, creating sufficient spatial separation to reduce mutual coupling and interference. The vertical and angular separation provided by the folded configuration allows compact packing while maintaining signal isolation.
Solution Approach 2:
The patent employs asymmetric arrangements of antenna elements with varying orientations, sizes, and positions. Different antenna elements are configured with distinct geometries and spatial relationships, which reduces pattern correlation and mutual coupling. The asymmetric layout optimizes radiation patterns and minimizes interference between closely spaced elements.
Data Source
AI summary
An antenna module includes an integrated circuit (IC), a substrate having a first region having one or more antenna disposed on a surface thereof and a second region flexibly bent and electrically connected to the IC to provide an electrical connection path to the one or more antenna and the IC, a set substrate electrically connected to the IC, and a set module disposed on the set substrate between the set substrate and the first region.