Flexible Substrate Electronic Module Manufacturing
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Solution Overview
Problem
The manufacturing of electronic modules for portable objects, such as dual or hybrid cards, is expensive due to the use of traditional methods involving rigid substrates and complex wire bonding techniques.
Innovation Solution
A method using a low-cost flexible substrate with through holes and electrically conductive zones, assembled with an adhesive layer to an electrically conductive support, where an integrated circuit is connected via pads and a protective layer is deposited, allowing for both contact and contactless functions at a reduced cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional wire bonding techniques and rigid substrates are used, then manufacturing precision and reliability are improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive traditional rigid substrates and wire bonding processes with a flexible printed circuit board that uses conductive ink printing and adhesive bonding. This approach uses cheaper materials and simpler manufacturing processes to achieve the same electrical connection function, directly reducing manufacturing cost while maintaining reliability
Solution Approach 2:
The patent substitutes the mechanical wire bonding process with a chemical/adhesive bonding approach. Instead of mechanically attaching wires to pads, the invention uses conductive adhesive to create electrical connections, eliminating the need for complex wire bonding equipment and reducing manufacturing complexity and cost
2Reliability
If complex wire bonding and rigid substrates are used, then electrical connection reliability is improved, but device complexity increases
Solution Approach 1:
The patent changes the fundamental parameters of the manufacturing process by transitioning from rigid substrates to flexible substrates, and from wire bonding to conductive adhesive printing. This parameter change simplifies the manufacturing process by eliminating complex alignment and bonding equipment while maintaining electrical connection reliability through the conductive properties of the adhesive material
Solution Approach 2:
The patent extracts and eliminates the wire bonding step from the manufacturing process entirely. By using pre-printed conductive traces on the flexible circuit board and conductive adhesive for bonding, the invention removes the need for separate wire attachment operations, thereby reducing device complexity and manufacturing process steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces manufacturing costs while maintaining functionality, enabling the production of cost-effective electronic modules compatible with various applications, including payment and identity cards.
Implementation Method 1
Assemble the second face of said flexible substrate to said second face of said electrically conductive support by means of an adhesive layer
Data Source
Figure 1
Figure 2A~3
Figure 4
AI summary
The invention concerns a method for manufacturing one or more electronic modules comprising at least the following steps: Using: A substrate (6) comprising a plurality of connection through-holes, at least one electrically conductive area, one or more connection pads and a second face, An electrically conductive support (1) comprising, on a first face, one or more connection areas; Assembling the second face of the substrate (6) to a second face (1b) of the support (1); Positioning an integrated circuit (12) on or at a face of the substrate (6); Connecting one or more contacts of the integrated circuit (12) to the connection area or areas via the connection holes (11), and to the connection pads; Depositing a protective layer (13) at the integrated circuit. Use of the electronic module in a card.