Flexible Substrate IC Package with Mounded Encapsulation

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Solution Overview

Problem

Current electronics packaging technologies face challenges in accommodating high-speed devices exceeding one TeraHertz, with limitations in assembly, cooling, reliability, and cost-effectiveness, particularly in achieving smaller footprints and more robust packages for portable electronics.

Innovation Solution

An integrated circuit package system utilizing a flexible circuit substrate with a mounded encapsulation having two levels, where the flexible circuit substrate is folded over the second level, providing electrical connections and structural reinforcement through solder ball interconnects and die attach adhesives, and supporting various IC packages and configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If current packaging technologies are used for high-speed devices exceeding one TeraHertz, then device functionality is achieved, but assembly challenges and reliability concerns arise

Engineering Contradiction:

Improvedevice operating speedVSAvoidassembly reliability

Core Design Contradiction:

SpeedVSReliability

Solution Approach 1:

The packaging system is divided into multiple components including a substrate, encapsulation structure, and interconnect elements that can be manufactured and tested separately before final assembly. This segmentation allows for specialized manufacturing processes for each component, improving overall assembly reliability for high-speed devices.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces a three-dimensional encapsulation structure with multiple levels that provides mechanical support and stress relief in the vertical dimension, rather than relying solely on planar packaging approaches. This dimensional change helps accommodate thermal expansion and mechanical stresses in high-speed devices.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If packaging size is reduced to achieve smaller footprints, then portability is improved, but cooling and reliability concerns worsen

Engineering Contradiction:

Improvepackage footprintVSAvoidthermal management

Core Design Contradiction:

Area of stationary objectVSTemperature

Solution Approach 1:

The encapsulation structure employs a nested design where multiple protective and functional layers are integrated within each other, allowing comprehensive functionality including thermal management, mechanical protection, and electrical isolation within a compact footprint suitable for portable electronics.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent utilizes flexible encapsulation materials and thin-film structures that provide effective thermal pathways and mechanical compliance in reduced space. These flexible structures can conform to device geometries and provide efficient heat dissipation despite the compact package size.

Inventive Principle:

Principle #30Flexible shells and thin films

3Adaptability or versatility

If more components with varied environmental needs are incorporated, then device functionality is enhanced, but manufacturing complexity and error risk increase

Engineering Contradiction:

Improvedevice functionalityVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The substrate and encapsulation structures are designed with universal features that can accommodate multiple different device types and environmental requirements through standardized interfaces and mounting configurations, reducing manufacturing complexity despite enhanced device functionality.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent incorporates preliminary preparation features in the substrate and encapsulation design, such as pre-formed interconnect structures, pre-positioned mounting features, and pre-integrated thermal management elements, that simplify subsequent assembly steps and reduce manufacturing errors when incorporating multiple components.

Inventive Principle:

Principle #10Preliminary action

4Ease of manufacture

If traditional encapsulation structures are used, then manufacturing is simpler, but solder ball interconnect reliability and fatigue life are reduced

Engineering Contradiction:

Improveencapsulation manufacturingVSAvoidinterconnect fatigue life

Core Design Contradiction:

Ease of manufactureVSDuration of action of moving object

Solution Approach 1:

The encapsulation structure employs composite material construction combining different materials with complementary properties, such as rigid support elements combined with flexible sealing layers, to simultaneously achieve manufacturability and enhanced fatigue resistance for solder ball interconnects in portable electronics applications.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS8031475B2Integrated circuit package system with flexible substrate and mounded package

Publication Date: 2011.10.04 STATS CHIPPAC LTD

AI summary

An integrated circuit package system includes: providing a flexible circuit substrate; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a mounded encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.