Flexible Substrate Mounting Package for High-Frequency Stability

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Solution Overview

Problem

Existing electronic component mounting packages for high-frequency applications face challenges in maintaining reliable connections and reducing stress due to thermal expansion differences and positional displacement, which can lead to instability and frequency characteristic variations.

Innovation Solution

The package includes a housing with a concave and notched portion, a coaxial connector with a terminal and sealing member, and a flexible substrate that abuts on a projecting ridge, ensuring proper alignment and stress distribution, while the housing is made of thermal expansion-matched materials to alleviate thermal stress and the flexible substrate is designed to maintain frequency characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a rigid housing structure is used to maintain connection stability, then structural strength is improved, but stress concentration and thermal expansion damage occur

Engineering Contradiction:

Improveconnection stabilityVSAvoidthermal expansion resistance

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent employs a flexible substrate instead of a rigid connection structure. The flexible substrate can bend and deform to accommodate thermal expansion differences between the housing and electronic component, while maintaining electrical connection. This resolves the contradiction by providing both connection stability and thermal expansion resistance through material flexibility.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the mechanical parameters of the connection structure by using a flexible substrate with specific elasticity and bending properties. This allows the connection structure to dynamically adapt its shape and stress distribution in response to thermal changes, maintaining reliability across temperature variations.

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If the flexible substrate extends directly without bending, then manufacturing simplicity is improved, but positional displacement and connection instability occur

Engineering Contradiction:

Improvesubstrate installationVSAvoidconnection stability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent introduces a dynamic bending structure in the flexible substrate that allows the substrate to adapt its shape during operation. The bending portion enables the substrate to move and adjust its position, maintaining stable electrical connection despite thermal expansion or contraction of the housing and component.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent adds a spatial dimension to the substrate configuration by creating a bent shape with specific curvature. This three-dimensional configuration allows the substrate to navigate around thermal displacement while maintaining connection, transforming a simple linear extension into a multi-dimensional adaptive structure.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Device complexity

If the housing structure is simplified without notched portions, then device complexity is reduced, but stress concentration and structural damage occur

Engineering Contradiction:

Improvehousing structureVSAvoidstress distribution

Core Design Contradiction:

Device complexityVSStrength

Solution Approach 1:

The patent introduces asymmetric notched portions in the housing structure that are strategically positioned to redirect and distribute stress. These notches create a non-uniform stress distribution pattern that prevents stress concentration at critical joints, enhancing structural strength while maintaining relatively simple overall housing geometry.

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the reliability of connections, reduces positional displacement, and maintains stable frequency characteristics, improving the overall performance and reliability of high-frequency electronic devices.

Implementation Method 1

The flexible substrate abuts on the projecting ridge portion so as to be bent

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

the housing is made of thermal expansion-matched materials to alleviate thermal stress

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS10462904B2Electronic component mounting package and electronic device

Publication Date: 2019.10.29 KYOCERA CORP

AI summary

An electronic component mounting package includes a body portion which accommodates an electronic component; a flexible substrate. The body portion comprises a notched portion which is open to a lower surface and a side surface thereof, and is provided with a projecting ridge portion which extends along a side end portion of the notched portion on a side surface side of the notched body portion. The flexible substrate extends from an interior of the notched portion to an exterior of the notched portion, and comprises a fixed end portion joined to a terminal of a coaxial connector disposed on a bottom surface of the notched portion, and a free end portion extending to the exterior of the notched portion. The flexible substrate abuts on the projecting ridge portion to be bent.