Flexible Driving Substrate Layout for Narrow-Bezel Splicing
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Solution Overview
Problem
Existing Micro/mini-LED display technologies face challenges in achieving narrow frame widths during splicing, leading to reduced display effectiveness due to increased seam widths and potential film layer failures from bending stress.
Innovation Solution
A driving substrate design with a device disposing area, a bending area, and a bonding area, featuring a buffer layer, conductive layers, and a flexible dielectric layer, allowing the substrate to bend and reducing the bending margin, thereby minimizing the frame width and enhancing film layer flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the substrate is designed with a bending area to enable splicing, then the frame width is reduced, but the film layers may fail due to bending stress
Solution Approach 1:
The substrate is divided into three distinct areas: device disposing area, bending area, and bonding area. The bending area is specifically designed as a separate segment that can undergo deformation, isolating the stress from the device and bonding regions. This segmentation allows the frame width to be reduced while maintaining film layer integrity in critical areas.
Solution Approach 2:
Different regions of the substrate are assigned different functional properties. The bending area has specific structural characteristics (such as reduced thickness or flexible material composition) that enable it to withstand bending stress, while the device disposing area and bonding area maintain their original structural integrity. This local differentiation allows the frame to be narrow without compromising overall reliability.
2Area of stationary object
If multiple driving substrates are spliced to achieve large-area display, then the display area is increased, but the seam width increases reducing display effectiveness
Solution Approach 1:
The large-area display is achieved by segmenting the overall display into multiple smaller driving substrates that are spliced together. Each substrate maintains its own complete functional structure, allowing independent manufacturing and testing, then assembled into a large-area configuration. The bending area enables these segments to be joined with minimal seam width.
Solution Approach 2:
The splicing technique transitions from traditional edge-to-edge joining to a configuration where the bending area allows substrates to be connected in a manner that reduces the visible seam dimension. By utilizing the bending capability, substrates can be joined with overlapping or interlocking structures that minimize the seam width in the display plane, thereby maintaining display effectiveness while achieving large area coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively reduces the width of the single-side frame, improves the flexibility and reduces the failure risk of film layers during bending, resulting in enhanced display performance and longer substrate lifespan.
Implementation Method 1
a flexible dielectric layer, allowing the substrate to bend and reducing the bending margin
Implementation Method 2
an adhesive layer is disposed between the surface of the base plate located in the bonding area away from the flexible dielectric layer and the surface of the base plate located in the device disposing area away from the flexible dielectric layer
Data Source
AI summary
A driving substrate, a light-emitting apparatus and a manufacturing method thereof, a splicing display apparatus, the driving substrate includes: a device disposing area, a bending area and a bonding area, the bending area is located between the device disposing area and the bonding area; the driving substrates located in the device disposing area, the bending area, and the bonding area include a buffer layer, a first conductive layer and a flexible dielectric layer that are stacked in sequence; the driving substrates located in the device disposing area and the bonding area further include a base plate disposed at a side of the buffer layer away from the first conductive layer, and a second conductive layer disposed at a side of the flexible dielectric layer away from the first conductive layer; and the driving substrate located in the bending area is configured to be able to bend along a bending axis.