Flexible Substrate Electro-Optical Module Assembly
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Solution Overview
Problem
The integration of electronic and optical components on a flexible substrate for high-volume production of electro-optical modules is challenging due to different form factors and processing requirements, making batch processing difficult.
Innovation Solution
A method involving a flexible substrate with integrated electronic and optical components, where a frame with openings is used to expose and affix components, followed by laser cutting to form electro-optical module assemblies, and the inclusion of a micro-energy source, enabling efficient fabrication of these modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If various complex components (semiconductor die, photodiode/LED, micro-energy source, optical lens) are assembled to form electro-optical modules, then the functionality and application scope are improved, but the assembly complexity and difficulty of batch processing increase due to different form factors and processing requirements
Solution Approach 1:
The patent merges multiple complex components (semiconductor die, photodiode/LED, micro-energy source, optical lens, electronic components) onto a single flexible substrate, integrating them into a unified electro-optical module assembly. This combining approach reduces assembly complexity by providing a pre-integrated structure that can be handled and processed as one unit rather than assembling multiple separate components.
Solution Approach 2:
The flexible substrate serves as a universal platform that can accommodate various types of components with different form factors and processing requirements. The substrate acts as a common foundation for electronic components, optical components, and micro-energy sources, enabling batch processing of diverse electro-optical module configurations through standardized substrate fabrication processes.
2Adaptability or versatility
If components with different form factors and processing requirements are integrated, then the functionality of electro-optical modules is improved, but the ease of batch processing deteriorates
Solution Approach 1:
The patent segments the electro-optical module into distinct functional areas on the flexible substrate: electronic component regions, optical component regions, and micro-energy source regions. Each area can be fabricated and processed independently according to its specific requirements, then integrated together on the substrate. This segmentation enables specialized processing for each component type while maintaining overall batch processing capability through the unified substrate approach.
Solution Approach 2:
The flexible substrate acts as an intermediary platform that mediates between components with different form factors and processing requirements. It provides a common fabrication platform where diverse components can be positioned, connected, and integrated using standardized substrate processing techniques, thereby enabling batch manufacturing of complex multi-component assemblies.
3Manufacturing precision
If a frame with openings is used to expose components and a mask is used for opening formation, then the precision of component exposure and alignment is improved, but the manufacturing time and process steps increase
Solution Approach 1:
The frame with openings is prepared in advance as a precision alignment tool before the actual component assembly process. The openings are pre-configured to match the positions of electronic components, optical components, and micro-energy sources on the flexible substrate. This preliminary preparation of the frame enables rapid, high-precision exposure and alignment of components during the assembly process, reducing the time required for positioning and alignment steps.
Solution Approach 2:
The frame structure with openings serves as a self-aligning mask that automatically positions itself relative to the flexible substrate and its components. The geometric relationship between the frame openings and component locations provides inherent alignment references, allowing the system to self-correct positioning errors and maintain manufacturing precision without requiring complex external alignment equipment or procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the efficient fabrication of electro-optical module assemblies with integrated electronic, optical, and micro-energy components, facilitating high-volume production by standardizing the assembly process and improving component integration.
Implementation Method 1
a frame containing openings therein is brought into contact with the first surface of the flexible substrate, wherein each opening of the frame physically exposes at least one of the electric components and an electro-optical module assembly area
Implementation Method 2
An opening is then formed in an inner portion of each electro-optical module assembly area of the flexible substrate utilizing the frame as a mask
Implementation Method 3
an optical component is affixed to the second surface of the flexible substrate and within each electro-optical module assembly area
Implementation Method 4
at least one micro-energy source is provided to the first surface of each pre-electro-optical module assembly
Data Source
AI summary
An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.