Flexible Device Substrate With Oxide-Glass Adhesion Structure

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Solution Overview

Problem

Substrates for flexible devices, such as organic EL lighting and solar cells, face challenges with moisture barrier properties, adhesion, bending strength, and manufacturing complexity, particularly with stainless steel sheets where nickel plating is required for adequate adhesion and rust resistance.

Innovation Solution

A substrate comprising a stainless steel sheet with a chromium-rich oxide layer and a bismuth-based glass layer, where the oxide layer thickness and chromium concentration enhance adhesion and bending strength, eliminating the need for nickel plating and simplifying the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a stainless steel sheet is used as the metal sheet, then rust resistance is improved, but adhesion between the metal sheet and glass layer deteriorates

Engineering Contradiction:
Improverust resistanceVSAvoidadhesion
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

A nickel plating layer is introduced as an intermediary between the stainless steel sheet and the glass layer. The nickel plating layer provides excellent adhesion to both the stainless steel substrate and the glass coating, solving the adhesion problem while maintaining the rust resistance of the stainless steel base material.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The substrate structure is designed as a composite material system consisting of multiple layers: stainless steel sheet, nickel plating layer, and glass layer. Each layer contributes specific properties - the stainless steel provides rust resistance, the nickel plating provides adhesion, and the glass provides insulation and smoothness, achieving overall performance optimization.

Inventive Principle:
Principle #40Composite materials

2Strength

If a nickel plating layer is formed on the stainless steel sheet, then adhesion is improved, but manufacturing complexity increases

Engineering Contradiction:
ImproveadhesionVSAvoidmanufacturing process complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The invention optimizes specific parameters of the nickel plating layer, including thickness (5-50 nm) and chromium concentration at the interface (30-80 atomic %), to achieve sufficient adhesion with minimized plating thickness, thereby reducing manufacturing complexity and cost while maintaining performance.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The substrate achieves excellent moisture barrier, adhesion, and bending strength, reducing manufacturing steps and improving quality control, while preventing rust and peeling, making it suitable for flexible device applications like organic EL lighting and solar cells.

Implementation Method 1

a chromium-rich oxide layer... where the oxide layer thickness and chromium concentration enhance adhesion

Methodology Applied
Scientific EffectOxidation: Oxidation

Implementation Method 2

a glass layer of electrically-insulating bismuth-based glass in a form of layer formed on the surface of the oxide layer

Methodology Applied
Scientific EffectDeposition: Deposition (physical)

Data Source

PatentUS12144239B2Substrate for flexible device
Publication Date: 2024.11.12 TOYO SEIKAN GRP HLDG LTD
  • US12144239B2 patent drawing

AI summary

A substrate for flexible device, including a stainless steel sheet, an oxide layer formed on a surface of the stainless steel sheet, and a glass layer of electrically-insulating bismuth-based glass formed in a form of layer on the surface of the oxide layer. Also disclosed is a sheet for flexible device, including a stainless steel sheet, and an oxide layer on a surface of the stainless steel sheet, the oxide layer having a thickness of not less than 30 nm.