Flexible Substrate Peeling via Polyorganosiloxane Adhesive Layer

Solution Overview

Problem

The existing methods for preparing organic electronic devices on flexible substrates face efficiency degradation and potential damage during the peeling process due to improper removal of adhesive materials, which complicates the use of flexible substrates with rigid carriers.

Innovation Solution

A method involving the formation of a polymer layer with a convex portion on a carrier substrate, allowing for proper adhesion and easy peeling of the flexible substrate, using polyorganosiloxane materials that can control adhesive strength and shape, thereby minimizing the need for edge removal operations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If adhesive material is used to attach flexible substrate to carrier substrate, then proper adhesion strength is achieved, but preparation efficiency is degraded due to additional removal process

Engineering Contradiction:

Improveadhesive strengthVSAvoidpreparation efficiency

Core Design Contradiction:

StrengthVSProductivity

Solution Approach 1:

The adhesive material is selectively removed only from the edge region of the carrier substrate, not the entire adhesive layer. This extraction approach maintains adhesion strength where needed while eliminating the time-consuming complete removal process, thus improving preparation efficiency without sacrificing bonding strength.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The adhesive material is pre-removed from the edge region before the peeling process. This preliminary action prevents potential damage to the flexible substrate or organic electronic elements during peeling, while avoiding the need for complete adhesive removal, thereby maintaining both adhesion strength and preparation efficiency.

Inventive Principle:

Principle #10Preliminary action

2Productivity

If adhesive material is not properly removed from edge region, then preparation process is simplified, but elements may be damaged during peeling off

Engineering Contradiction:

Improvepreparation efficiencyVSAvoidelement integrity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The adhesive material is pre-removed from the edge region before the peeling process. This preliminary action prevents potential damage to the flexible substrate or organic electronic elements during peeling, while avoiding the need for complete adhesive removal, thereby maintaining both adhesion strength and preparation efficiency.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The adhesive material is selectively removed only from the edge region where it is not needed, while maintaining adhesive strength in the central region where bonding is required. This local differentiation ensures element integrity during peeling while preserving preparation efficiency.

Inventive Principle:

Principle #3Local quality

3Reliability

If complete adhesive removal is performed, then no damage occurs during peeling, but additional process time is required

Engineering Contradiction:

Improveelement integrityVSAvoidprocess time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The adhesive material is selectively removed only from the edge region of the carrier substrate, not the entire adhesive layer. This extraction approach maintains adhesion strength where needed while eliminating the time-consuming complete removal process, thus improving preparation efficiency without sacrificing bonding strength.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of completely removing the adhesive material, only a partial removal from the edge region is performed. This partial action is sufficient to prevent damage during peeling while avoiding the excessive time required for complete removal, optimizing the balance between reliability and process time.

Inventive Principle:

Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the efficiency of organic electronic device preparation by ensuring proper support and easy peeling of flexible substrates without damaging the devices, improving the overall preparation process.

Implementation Method 1

the polymer layer may serve to easily peel off the flexible substrate during a subsequent peeling operation

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS10950808B2Method of preparing organic electronic device

Publication Date: 2021.03.16 LG DISPLAY CO LTD

AI summary

A method of preparing an organic electronic device, an organic electronic device prepared using the same, and a use thereof are provided. For example, the method of effectively preparing an organic electronic device using a flexible substrate, the organic electronic device prepared using the same, and the use thereof may be provided.