Flexible Substrate Peeling for Display Electrode Exposure
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Solution Overview
Problem
Existing methods for manufacturing display devices with flexible substrates often damage electrodes and display regions, leading to reduced reliability and manufacturing yield due to the need to expose electrodes, causing signal and power attenuation from increased wiring resistance.
Innovation Solution
A method involving a series of processes including the formation of layers and insulating layers on substrates, overlapping with bonding layers, and peeling to expose electrodes without direct removal by laser or edged tools, ensuring minimal damage and optimal spacing for reliable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If part of the flexible substrate is removed by a laser beam or an edged tool to expose an electrode, then the electrode can be connected to external electrodes, but the electrode and display region are easily damaged and reliability is reduced
Solution Approach 1:
The patent introduces a flexible printed circuit board as an intermediary component to connect to the electrode. Instead of directly removing substrate to expose the electrode, the FPC board provides a connection interface that interfaces with the electrode through a bonding layer, thereby avoiding direct damage to the electrode while still enabling external connections
Solution Approach 2:
The patent performs preliminary actions by forming the electrode and bonding layer on the flexible substrate before final assembly. The electrode is prepared with a bonding layer that can subsequently bond to the FPC board, allowing connections to be established without requiring later substrate removal that would risk electrode damage
2Ease of operation
If part of the flexible substrate is removed by a laser beam or an edged tool, then electrode exposure is achieved, but manufacturing yield is reduced
Solution Approach 1:
The FPC board serves as a mediator that enables electrode exposure and connection without the need for laser beam or edged tool removal of the flexible substrate. This intermediary approach eliminates the harmful removal process entirely, thereby maintaining high manufacturing yield while still achieving the necessary electrode exposure for connections
Solution Approach 2:
The patent extracts the substrate removal step from the manufacturing process entirely. Instead of taking out material through laser or mechanical means, the design extracts the connection function to an external FPC board component, eliminating the source of manufacturing defects and yield loss
3Reliability
If sufficient space is provided between display region and electrode to prevent damage, then electrode protection is improved, but signal attenuation and power loss increase due to increased wiring resistance
Solution Approach 1:
The patent transitions the connection problem from a two-dimensional planar layout issue to a three-dimensional vertical stacking arrangement. By bonding the FPC board to the flexible substrate in a vertical dimension, the electrode can be positioned closer to the display region in the planar view while maintaining protection through the bonding layer structure, thereby reducing wiring resistance without compromising electrode safety
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents electrode and display region damage, enhancing the reliability and manufacturing yield of display devices by maintaining electrode integrity and reducing signal and power loss.
Implementation Method 1
part of the flexible substrate be removed by a laser beam or an edged tool to expose an electrode
Data Source
AI summary
A method for manufacturing a display device is provided. The method includes forming a display element interposed between a first substrate and a second substrate and peeling the second substrate from the first substrate so that an electrode, which is located between the first and second substrates and to be connected to an external electrode, is exposed simultaneously with the peeling of the second substrate.