Flexible Substrate Peeling via Releasing Layer Recycle
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Solution Overview
Problem
The challenge in manufacturing flexible display devices lies in peeling the flexible substrate from a glass carrier substrate without damaging the electrical devices due to strong adhesive forces, making it difficult to recycle the releasing layer and carrier substrate efficiently.
Innovation Solution
A method is developed where a releasing layer is formed on a carrier substrate, allowing a flexible substrate to be formed on it with specific spacing and peeling forces between 5 gf/cm to 10 gf/cm, enabling the flexible substrate to be separated while keeping the releasing layer on the carrier substrate, which can then be recycled.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the flexible substrate is directly formed on the glass carrier substrate with strong adhesive force, then the flexible substrate is firmly fixed, but it becomes difficult to peel off and may damage the electrical devices
Solution Approach 1:
The patent introduces a releasing layer as an intermediate layer between the flexible substrate and the glass carrier substrate, segmenting the direct adhesive bond into two separate adhesive interfaces. This allows the peeling process to occur at the releasing layer interface rather than directly at the flexible substrate interface, enabling easy separation without damaging the electrical devices while maintaining strong fixation during manufacturing.
Solution Approach 2:
The releasing layer serves as an intermediary element that mediates between the flexible substrate and the glass carrier substrate. It provides controlled adhesion properties that allow for both strong fixation during the manufacturing process and easy peeling afterward, resolving the contradiction between strong bonding and easy separation.
2Ease of operation
If the releasing layer is discarded after use, then the peeling process is simple, but the manufacturing cost increases due to material waste
Solution Approach 1:
The patent enables the releasing layer to be recovered and reused by designing it to remain on the glass carrier substrate after peeling. The releasing layer can be cleaned and prepared for reuse in subsequent manufacturing cycles, transforming it from a single-use consumable material into a recyclable component, thereby reducing material waste and manufacturing costs while maintaining ease of operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the successful separation of the flexible substrate from the carrier substrate with controlled peeling forces, ensuring the releasing layer remains intact for reuse, reducing manufacturing costs and minimizing damage to the electrical devices.
Implementation Method 1
a peeling force between the flexible substrate and the releasing layer is greater than or equal to 5 gf/cm and is smaller than or equal to 10 gf/cm
Data Source
AI summary
A method for manufacturing a flexible electrical device is provided and includes the following steps. A carrier substrate is provided. A releasing layer is formed on the carrier substrate. A flexible substrate is formed on the releasing layer. The flexible substrate has a first surface facing the releasing layer and a second surface opposite to the first surface. The flexible substrate is not in contact with the carrier substrate. A device layer is formed on the flexible substrate. The device layer has a third surface facing the flexible substrate and a fourth surface opposite to the third surface. The flexible substrate is separated from the releasing layer, and the releasing layer remains on the carrier substrate. Accordingly, the releasing layer and the carrier substrate can be recycled for forming another flexible electrical device.