Flexible Substrate Peeling via UV Viscosity Reduction
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Solution Overview
Problem
The high adhesion of adhesives in flexible substrate peeling processes leads to rebinding issues, resulting in low peeling efficiency.
Innovation Solution
A peeling method involving a flexible substrate formed on a base substrate, where a protective film is adhered using an ultraviolet viscosity-reducing adhesive, and specific regions are irradiated with ultraviolet light to reduce adhesion, allowing for efficient peeling of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a cutter is inserted to cut the adhesive between the protective film and base substrate, then the flexible substrate can be separated from the base substrate, but the adhesive will rebind after cutting due to high adhesion, reducing peeling efficiency
Solution Approach 1:
The patent changes the physical-chemical state of the adhesive by irradiating it with ultraviolet light, which reduces the viscosity and adhesion of the UV-responsive adhesive. This parameter change allows the adhesive to be easily separated without rebinding, solving the contradiction between peeling efficiency and separation reliability
Solution Approach 2:
The patent applies preliminary action by irradiating the adhesive with ultraviolet light before the peeling process to pre-reduce its adhesion. This preliminary modification of the adhesive's physical state ensures that subsequent peeling operations can proceed efficiently without the adhesive rebinding during the process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces adhesive viscosity upon ultraviolet light exposure, enabling easy separation of the flexible substrate from the base substrate with minimal external force, improving peeling efficiency and maintaining the relative position of the substrate and protective film.
Implementation Method 1
irradiating a region on the base substrate covered by the protective film through the base substrate with an ultraviolet light
Data Source
AI summary
This disclosure relates to a peeling method of a flexible substrate, and belongs to the technical field of flexible display. The method comprises the steps of: (a) forming a flexible substrate on a base substrate, wherein the flexible substrate has a plane area less than that of the base substrate; (b) adhering a protective film on the base substrate formed with the flexible substrate by an ultraviolet viscosity-reducing adhesive, wherein the plane area of the flexible substrate is less than that of the protective film, and the protective film is further adhered to the base substrate by the ultraviolet viscosity-reducing adhesive; (c) irradiating a region on the base substrate covered by the protective film through the base substrate with an ultraviolet light; and (d) peeling the protective film and the flexible substrate from the base substrate after the irradiation with an ultraviolet light is completed.