Flexible Substrate Recesses for Uniform Light Reflection in Sensing Devices
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Solution Overview
Problem
Traditional optical sensors face issues with light reflection interference due to air bubbles or gaps between the substrate and conductive films, leading to uneven brightness and compromised sensing quality.
Innovation Solution
A sensing device with a flexible substrate featuring recesses on its surface, where a reflective layer conforms to the inner surfaces of these recesses, and a planarization layer is applied to fill them, ensuring uniform light reflection and improved image resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive film is bonded on the back of the substrate, then electrostatic protection is provided, but air bubbles or gaps are formed causing light reflection interference and uneven brightness
Solution Approach 1:
The patent applies a preliminary action by forming the reflective layer on the substrate surface before bonding the conductive film on the back. This reflective layer serves as a pre-prepared structure that manages light reflection before the bonding process occurs, preventing the formation of air bubbles and gaps from causing interference. The reflective layer is deposited in advance to ensure uniform light distribution regardless of bonding imperfections.
Solution Approach 2:
The patent converts the harmful effect of light reflection from air bubbles and gaps into a beneficial feature by introducing a controlled reflective layer. Instead of trying to eliminate all air bubbles through perfect bonding, the invention uses the reflective layer to deliberately manage light reflection, converting potential defects into a functional advantage that enhances electrostatic protection while maintaining uniform brightness.
2Ease of manufacture
If air bubbles or gaps are present between substrate and conductive film, then bonding process is simplified, but light reflection interference occurs resulting in uneven brightness
Solution Approach 1:
The patent converts the harmful light reflection from air bubbles into a beneficial feature by adding a controlled reflective layer. This layer deliberately manages light reflection to create uniform brightness, transforming the simplified bonding process with potential gaps from a defect into an acceptable manufacturing approach that still achieves optical uniformity.
Solution Approach 2:
The reflective layer is applied specifically on the substrate surface where light reflection occurs, providing localized optical control. This local quality enhancement addresses the brightness uniformity issue at the specific location where light interaction happens, without requiring changes to the overall bonding process simplicity.
3Manufacturing precision
If a reflective layer is added on the substrate surface, then light reflection interference is reduced, but device structure becomes more complex
Solution Approach 1:
The reflective layer is deposited as a preliminary step in the device fabrication process, before other components are assembled. This preliminary action integrates the light reflection control function into the base structure early on, preventing reflection issues from propagating through subsequent manufacturing steps and reducing overall process complexity.
Solution Approach 2:
The reflective layer serves multiple functions simultaneously: it controls light reflection to prevent interference, provides a bonding surface for the conductive film, and maintains structural integrity of the substrate. This multi-functionality reduces device complexity by combining several roles into a single layer rather than requiring separate components for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces light reflection interference, enhancing the sensing quality by providing a uniform light distribution and improved image resolution through the strategic design of recesses and reflective layers on the flexible substrate.
Implementation Method 1
a reflective layer is located on the flexible substrate and conforms to an inner surface of the recesses
Implementation Method 2
The photodiode may convert light energy into electrical signals
Data Source
AI summary
A sensing device includes a flexible substrate, a reflective layer, a planarization layer, plural switching elements and plural sensing elements. The flexible substrate has plural recesses on a surface. The reflective layer is located on the flexible substrate and conforms to an inner surface of the plural recesses. The planarization layer is disposed on the reflective layer. The plural switching elements are disposed on the planarization layer. The plural sensing elements are disposed on the planarization layer and electrically connected to the plural switching elements respectively. A method for fabricating a sensing device is also provided.