Flexible Substrate Manufacturing via Segmented Layer Stripping
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Solution Overview
Problem
The existing methods for manufacturing flexible substrates and display substrates face defects such as wrinkles or bubbles due to the incomplete removal of the second flexible substrate layer during the stripping of the rigid base substrate, leading to damage to the inorganic layer and the second PI layer.
Innovation Solution
A method involving the sequential formation of a first flexible substrate layer, a first inorganic layer, and a second flexible substrate layer on a rigid base substrate, where the orthographic projection of the second flexible substrate layer is located within the first flexible substrate layer, allowing for the selective removal of the rigid base substrate without leaving the second flexible substrate layer behind, thus preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the second flexible substrate layer is formed extending beyond the first flexible substrate layer during manufacturing, then the stripping process becomes easier, but the inorganic layer and second PI layer get damaged due to incomplete removal
Solution Approach 1:
The patent divides the flexible substrate layer into two distinct parts: a first flexible substrate layer that remains during stripping, and a second flexible substrate layer that is removed. This segmentation allows the stripping process to selectively remove only the intended layer while preserving the inorganic layer and first PI layer, thereby resolving the contradiction between ease of manufacture and layer integrity.
Solution Approach 2:
The patent extracts the second flexible substrate layer as a separate removable component that extends beyond the first flexible substrate layer. This extraction enables the stripping process to easily remove the second layer while leaving the critical inorganic layer and first PI layer intact, solving the problem of incomplete removal damaging the structure.
2Manufacturing precision
If the second flexible substrate layer is completely removed during stripping, then manufacturing quality improves, but the process becomes more complex and difficult to control
Solution Approach 1:
The patent applies local quality by giving different spatial characteristics to different parts of the flexible substrate layer. The second flexible substrate layer is designed to extend beyond the first layer only in specific regions, creating local differences that enable selective removal. This local differentiation simplifies the stripping process while ensuring complete removal where needed, resolving the contradiction between manufacturing precision and process complexity.
Data Source
AI summary
The present disclosure discloses a flexible substrate and a method for manufacturing the same, and a flexible display substrate and a method for manufacturing the same. The method for manufacturing the flexible substrate includes: sequentially forming a first flexible substrate layer and a first inorganic layer on a rigid base substrate; forming a second flexible substrate layer on a side of the first inorganic layer distal from the first flexible substrate layer, an orthographic projection of the second flexible substrate layer on the first flexible substrate layer being located within the first flexible substrate layer; and stripping off the rigid base substrate to obtain the flexible substrate. The method solves the problem of poor process of the flexible substrate.