Flexible Substrate Semiconductor Manufacturing via Inorganic Adhesion Layer
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Solution Overview
Problem
The challenge lies in manufacturing semiconductor devices with high yield that have a layer containing an organic compound over a flexible substrate, as the adhesion between the organic compound layer and the second electrode layer is low, leading to separation issues during the separation process.
Innovation Solution
A method is developed where a region with low adhesion between the organic compound layer and the second electrode layer is surrounded by a region with high adhesion, utilizing an inorganic compound layer that contacts the organic compound layer, preventing separation at the interface and allowing for high-yield separation and attachment to a flexible substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a separation layer is formed over a substrate and elements are separated from the substrate, then the semiconductor device can be transferred to a flexible substrate, but the adhesion between the organic compound layer and the second electrode layer is low causing separation at the interface
Solution Approach 1:
The patent applies local quality by forming an inorganic compound layer at specific locations (peripheral portions and/or interface regions) between the organic compound layer and second electrode layer. This creates localized regions with enhanced adhesion properties where needed, while maintaining the organic compound layer's semiconductor functionality in the central region. The inorganic compound layer has different material properties (polar substituents) compared to the organic compound layer, providing locally enhanced adhesion to the second electrode layer without affecting the overall device architecture or flexible substrate compatibility.
2Weight of moving object
If plastic films are used to reduce size and weight, then the device becomes more compact and lightweight, but the low heat resistance of plastic films prevents forming TFTs with favorable electrical characteristics
Solution Approach 1:
The patent segments the device structure into distinct functional layers: the flexible plastic film substrate provides mechanical support and flexibility, while the inorganic compound layer (formed at peripheral portions and/or interfaces) provides the necessary thermal and electrical stability. This segmentation allows each layer to fulfill its specific function - the plastic film reduces weight and enables flexibility, while the inorganic compound layer ensures favorable electrical characteristics and adhesion, resolving the contradiction between lightweight design and electrical performance.
3Ease of manufacture
If the adhesion between the organic compound layer and second electrode layer is low, then the separation process causes interface separation, but increasing adhesion may affect the semiconductor properties of the organic compound layer
Solution Approach 1:
The inorganic compound layer acts as an intermediary between the organic compound layer and the second electrode layer. It mediates the adhesion relationship by providing a interface that bonds well to both the organic compound layer (through physical contact and structural compatibility) and the second electrode layer (through polar substituent interactions). This intermediary layer enables successful separation from the substrate while maintaining interface integrity, as it prevents direct contact between the organic compound layer and second electrode layer that would otherwise cause separation during the separation process.
Data Source
Figure 1A~1E
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Figure 3A~3E
AI summary
It is an object of the present invention to manufacture, with high yield, semiconductor devices in each of which an element which has a layer containing an organic compound is provided over a flexible substrate. A method for manufacturing a semiconductor device includes: forming a separation layer over a substrate; forming an element-forming layer by forming an inorganic compound layer, a first conductive layer, and a layer containing an organic compound over the separation layer, and forming a second conductive layer which is in contact with the layer containing an organic compound and the inorganic compound layer; and after attaching a first flexible substrate over the second conductive layer, separating the separation layer and the element-forming layer at the separation layer.