Flexible Substrate Separation Using Elastic Suction Pads
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Solution Overview
Problem
Existing substrate separation methods for stacked bodies with flexible substrates face challenges in maintaining component quality due to low heat resistance and uneven force application during separation, particularly when separating rigid substrates with narrow gaps, which can lead to reduced yield and damage to the element layer.
Innovation Solution
A substrate separation apparatus featuring a fixing jig, first and second suction units with adjustable suction pads, and a wedge-shaped separation starting jig, allowing for controlled and uniform force application to securely separate substrates with a flexible substrate, while minimizing damage to the element layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible substrate is used directly for light-emitting device components, then the device flexibility is improved, but the component quality deteriorates due to low heat resistance and expansion/contraction during heating
Solution Approach 1:
The manufacturing process is divided into two stages: first forming components on a rigid substrate that can withstand high temperatures, then transferring the completed components to a flexible substrate. This segmentation allows each substrate to be used in its optimal environment - the rigid substrate for high-temperature processing and the flexible substrate for the final flexible device application.
Solution Approach 2:
All high-temperature manufacturing steps and alignment operations are performed in advance on the rigid substrate before transfer. The component layer is fully formed and cured on the rigid substrate, which provides dimensional stability during these preliminary actions, eliminating expansion/contraction issues that would occur if performed on the flexible substrate.
2Ease of manufacture
If components are formed directly on a flexible substrate, then the manufacturing process is simplified, but the upper-limit temperature must be set low which reduces component quality
Solution Approach 1:
The manufacturing process is segmented into component formation on a rigid substrate followed by transfer to a flexible substrate. This allows the component formation stage to use high temperatures and standard processes on the rigid substrate, while the flexible substrate is only involved in the final transfer and application stages.
Solution Approach 2:
The rigid substrate serves as an intermediary during the manufacturing process. It provides a stable platform for component formation that can withstand high temperatures, then the completed component layer is transferred to the flexible substrate. The rigid substrate acts as a temporary carrier that enables high-quality component formation without requiring the final flexible substrate to withstand high temperatures.
3Ease of operation
If a cut is formed in the separation layer with a blade and gas blow is used for separation, then separation can be induced, but the force required is not uniform which makes delicate adjustment impossible
Solution Approach 1:
The manual mechanical separation method using blade cuts and gas blow is replaced with a controlled heating system. The heating apparatus provides uniform thermal energy distribution across the separation layer, creating consistent thermal expansion forces that evenly separate the rigid substrate from the component layer without requiring manual intervention or causing localized stress concentrations.
Solution Approach 2:
The separation mechanism is changed from mechanical force application to thermal parameter control. By controlling the temperature distribution and heating rate, uniform thermal expansion is achieved across the separation layer, providing consistent separation force throughout the entire interface between the rigid substrate and component layer, enabling precise and controlled separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables secure and controlled separation of substrates with improved yield and reduced risk of damage to the element layer, allowing for precise alignment and transfer of components without compromising the quality of the light-emitting device.
Implementation Method 1
a first suction unit and a second suction unit for sucking the second substrate. The first suction unit includes a plurality of first suction portions provided along the outer periphery of the second substrate. The first suction portions each include a plurality of first suction pads capable of touching and being attached by suction to the top surface of the second substrate.
Data Source
AI summary
A wedge-shaped jig (6) is inserted into a gap between a first substrate (21) and a second substrate (22) at a corner (221) of the second substrate (22) and separation of the attached first substrate (21) and second substrate (22) starts to proceed; then, a second suction pad (53) of a second suction portion (51), which is the closest to the corner (221), moves upward. Then, first suction pads (43) of first suction portions (41a), (41b), and (41c) sequentially move upward such that one side of the second substrate (22) separates from the stacked body. Although the second substrate (22) warps as the separation of the second substrate (22) proceeds, each of the plurality of first suction pads (43) elastically deforms. Therefore, the first suction pads (43) can be prevented from being detached from the second substrate (22), and the substrate (22) can be securely separated from the stacked body.