Flexible Substrate Assembly for High-Density SMD Integration
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Solution Overview
Problem
Conventional electronic device manufacturing processes require expensive equipment and are limited by production accuracy, leading to high costs and low component density.
Innovation Solution
A method involving a flexible substrate made of organic polymer material with a glass transition temperature between 400 °C and 600 °C, where thin-film devices and surface-mount devices (SMDs) are directly formed and connected on the substrate, followed by removal of a rigid carrier plate, allowing for higher component density and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional semiconductor manufacturing process with pick-up head is used, then manufacturing process can be performed, but manufacturing cost becomes higher and component density is limited
Solution Approach 1:
The patent extracts and removes the rigid carrier plate from the manufacturing process, allowing the flexible substrate to be directly formed and processed without requiring complex pick-up and transfer equipment. This eliminates the need for expensive chip transferring equipment while enabling direct formation of thin-film devices and SMDs on the flexible substrate, thereby increasing component density and reducing manufacturing complexity.
2Ease of manufacture
If rigid carrier plate is used for manufacturing, then structural support is provided, but manufacturing cost increases and component density is limited
Solution Approach 1:
The patent employs a flexible substrate made of organic polymer material instead of a rigid carrier plate. This flexible substrate can be directly formed with thin-film devices and SMDs using simplified manufacturing processes, eliminating the need for expensive pick-up and transfer equipment. The flexible nature of the substrate enables higher component density while reducing manufacturing costs.
3Ease of manufacture
If complex chip transferring equipment is used, then semiconductor devices can be transferred onto circuit board, but manufacturing cost becomes higher
Solution Approach 1:
The patent merges the formation of thin-film devices, conductive lines, electrical connection pads, and SMDs into a single integrated manufacturing process on the flexible substrate. This eliminates the need for separate chip transferring operations and expensive equipment, thereby reducing manufacturing costs while maintaining high production efficiency through direct formation and connection of all components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of electronic devices with increased component density and lower production costs by simplifying the manufacturing process and eliminating the need for complex chip transferring equipment.
Implementation Method 1
a flexible substrate made of organic polymer material with a glass transition temperature between 400 °C and 600 °C
Data Source
Figure 1
Figure 2A~2C
Figure 2D~2E
AI summary
An electronic device and a manufacturing method thereof are disclosed. The manufacturing method of an electronic device includes following steps: forming a flexible substrate on a rigid carrier plate; forming at least a thin-film device on the flexible substrate; forming a conductive line on the flexible substrate, wherein the conductive line is electrically connected with the thin-film device; forming at least an electrical connection pad on the flexible substrate, wherein the electrical connection pad is electrically connected with the conductive line, and the thickness of the electrical connection pad is between 2 and 20 microns; disposing at least a surface-mount device (SMD) on the flexible substrate, wherein the SMD is electrically connected with the thin-film device through the electrical connection pad and the conductive line; and removing the rigid carrier plate.