Flexible Substrate Supporting Structure for Bend Reliability
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Solution Overview
Problem
Current electronic devices, particularly those with flexible substrates, face reliability and yield issues due to damage from bending, as peripheral elements are prone to damage, leading to reduced performance and functionality.
Innovation Solution
The electronic device incorporates a first flexible substrate, a second flexible substrate with distinct regions, a liquid crystal layer, and a supporting structure that includes a supporting film and adhesive layers to mitigate bending and protect peripheral elements, enhancing the device's structural integrity and preventing vapor intrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible substrates are used to enable bending, then adaptability and flexibility are improved, but reliability deteriorates due to damage to peripheral elements during bending
Solution Approach 1:
The second flexible substrate is divided into a first region (overlapping with the first flexible substrate) and a second region (not overlapping). The supporting structure is selectively disposed only on the second region, segmenting the support function to where it is most needed while maintaining flexibility in the first region.
Solution Approach 2:
The supporting structure with higher rigidity is locally applied to the second region of the second flexible substrate, creating a local quality difference. This allows the second region to have enhanced support for peripheral elements while the first region maintains flexibility for bending, resolving the contradiction between overall flexibility and local reliability.
2Adaptability or versatility
If peripheral elements are present in flexible devices, then functionality is improved, but reliability deteriorates due to susceptibility to bending damage
Solution Approach 1:
The supporting structure is selectively positioned in the second region where peripheral elements are located, providing localized reinforcement. This allows peripheral elements to maintain their functionality while being protected from bending damage by the rigid supporting film, resolving the contradiction between functionality and reliability.
3Adaptability or versatility
If flexible substrates are used, then adaptability is improved, but manufacturing precision deteriorates due to curling and deformation
Solution Approach 1:
The substrate is segmented into regions with different support characteristics. The second region with the supporting structure provides stable, curl-resistant properties for precise manufacturing and element placement, while the first region maintains flexibility for adaptability, resolving the contradiction between adaptability and manufacturing precision.
Solution Approach 2:
The supporting structure is pre-installed on the second flexible substrate before assembling the peripheral elements. This preliminary action provides a stable, curl-free foundation that ensures precise positioning and manufacturing of subsequent elements, while the overall device remains adaptable due to the flexible first region.
4Adaptability or versatility
If flexible substrates are used, then adaptability is improved, but protection from harmful factors deteriorates due to vapor intrusion
Solution Approach 1:
The device structure is segmented with the supporting structure forming a protective barrier in the second region. This segmentation creates a physical barrier against vapor intrusion while maintaining the flexible adaptability of the first region, resolving the contradiction between adaptability and protection from harmful factors.
Data Source
AI summary
The present disclosure provides an electronic device including a first flexible substrate, a second flexible substrate, a liquid crystal layer and a supporting structure. The second flexible substrate includes a first region and a second region. The first region overlaps with the first flexible substrate, and the second region does not overleap with the first flexible substrate. The liquid crystal layer is disposed between the first flexible substrate and the second flexible substrate. The supporting structure is disposed on the second region and includes a supporting film.


