Flexible Substrate Tiled Display Edge Connection Design
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Solution Overview
Problem
Existing tiled display devices face challenges in maintaining connection reliability and panel resolution due to limited bendable space and increased pitch between mini light-emitting diodes, leading to potential disconnection risks and visual gaps at connection positions.
Innovation Solution
The design incorporates a flexible substrate with increased bendable areas and optimized packaging structures for light-emitting units, where connection pads are positioned to protrude from the edge of the substrate, reducing the risk of disconnection and maintaining consistent pitch, thereby enhancing the reliability and display quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mini light-emitting diodes are used to achieve high resolution and wide viewing angles, then display quality is improved, but the pitch between diodes decreases which limits the available space at connection positions
Solution Approach 1:
The patent positions light-emitting units in a three-dimensional arrangement where portions protrude from the edge of the main substrate in the thickness direction. This vertical positioning allows connection pads to be disposed between adjacent light-emitting units without increasing the planar pitch, effectively utilizing the third dimension to resolve the space constraint at connection positions while maintaining high display resolution.
2Adaptability or versatility
If connection pads are positioned closer to edges to increase bendable space, then flexibility is improved, but the risk of wiring disconnection increases
Solution Approach 1:
The patent positions connection pads between adjacent light-emitting units rather than at the extreme edges of the substrate. This intermediate positioning provides a cushioning effect where the connection pads are protected by the surrounding light-emitting units, reducing the risk of disconnection during bending while still providing sufficient bendable space for flexible substrate configuration.
3Manufacturing precision
If pitch between mini light-emitting diodes is decreased to increase resolution, then display resolution is improved, but available space at connection positions is reduced
Solution Approach 1:
The patent utilizes the thickness direction to position connection pads between adjacent light-emitting units. This vertical arrangement allows high-resolution display with small pitch in the planar direction while creating sufficient connection space in the vertical dimension, effectively decoupling resolution from connection space constraints.
Data Source
Figure 1A
Figure 1B~1C
Figure 2A
AI summary
A tiled display device is provided. The tiled display device includes a first substrate, a second substrate and a light-emitting unit. The first substrate includes a first main substrate and a first flexible substrate. The first flexible substrate is disposed on the first main substrate. The second substrate is disposed adjacent to the first substrate. The light-emitting unit is disposed on the first flexible substrate. In addition, a portion of the light-emitting unit protrudes from an edge of the first main substrate.