Flexible Substrate Via Layout for Miniaturized Light-Emitting Devices
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Solution Overview
Problem
Light-emitting devices have not met the requirements for quality, function, and price in electronic products, particularly in terms of miniaturization and efficiency.
Innovation Solution
A light-emitting device is designed with a flexible substrate, a light-emitting unit, a thin film transistor, and a circuit, where the flexible substrate has vias for signal transmission, enabling miniaturization and efficient operation by using conductive layers, barrier layers, and protective layers to enhance electrical connectivity and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If light-emitting devices are miniaturized, then device size is reduced, but manufacturing precision and alignment accuracy deteriorate
Solution Approach 1:
The patent transitions from planar 2D layout to 3D vertical stacking, where circuit elements are arranged in multiple layers above and below the substrate. This dimensional change allows compact integration while maintaining lateral alignment accuracy, as connections are made through vertical vias rather than long lateral traces.
Solution Approach 2:
The patent implements nested structures where conductive layers, barrier layers, and protective layers are stacked within each other vertically. Multiple circuit layers are nested above and below the substrate, with connection vias nesting through the substrate thickness to interconnect different functional layers in a compact volume.
2Reliability
If conductive layers and barrier layers are added to enhance electrical connectivity, then electrical performance is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functional layers (conductive layers, barrier layers, protective layers) into an integrated stack structure. These layers are formed simultaneously or in sequence during the same fabrication process, merging multiple functions into a unified multi-layer system that improves electrical connectivity while managing complexity through process integration.
Solution Approach 2:
The patent uses composite layer structures where different materials (conductive, barrier, protective) are stacked together to achieve superior electrical performance. Each layer contributes specific properties, and their combination creates a composite structure that optimizes both connectivity and protection functions.
3Productivity
If the flexible substrate has vias for signal transmission, then signal transmission efficiency is improved, but substrate manufacturing difficulty increases
Solution Approach 1:
The patent forms connection vias and conductive patterns in the flexible substrate before bonding to the rigid substrate. This preliminary formation of conductive structures allows subsequent layers to be aligned and connected more easily, improving signal transmission efficiency while managing fabrication complexity through staged processing.
Data Source
AI summary
A light-emitting device is provided, which includes a flexible substrate having a via, a top surface, and a bottom surface, a light-emitting unit having a first electrode and a second electrode, and disposed on the top surface, a thin film transistor electrically connected to the light-emitting unit, a circuit disposed on the bottom surface, a conductive layer disposed in the via, a barrier layer covering the conductive layer, another conductive layer electrically connected to and in contact with the conductive layer and disposed outside the via, and another barrier layer in contact with a top surface of the another conductive layer. The conductive layer and the another conductive layer are disposed on opposite sides of the flexible substrate. The circuit is electrically connected to the first electrode through the via and electrically connected to the first electrode through the thin film transistor.