Flexible Substrate Wrap Structure for Warpage and Peeling Control
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Solution Overview
Problem
The existing fabrication process of flexible products faces challenges with warpage and easy peeling of flexible film layers from rigid layers due to thermal expansion coefficient differences, leading to high costs and reduced production yield.
Innovation Solution
A prefabricated substrate with a rigid film layer and a flexible film layer that partially wraps the rigid layer, featuring a double-sided attachment design with specific adhesive regions to suppress warpage and facilitate easy peeling, allowing for the formation of flexible modules with improved yield and reduced costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a low-warp and easy-to-separate glue material is used between the flexible layer and the rigid layer, then the degree of warpage is reduced, but the cost is quite high
Solution Approach 1:
The flexible layer is divided into multiple regions (first region, second region, third region) with different adhesive configurations. The second region uses adhesive layers for stable bonding, while the first and third regions are designed for easy separation, eliminating the need for expensive specialized glue materials throughout the entire structure.
Solution Approach 2:
Different regions of the flexible layer have different bonding characteristics: the second region has strong bonding to suppress warpage during fabrication, while the first and third regions have weak or no bonding to facilitate easy separation. This localized differentiation resolves the contradiction between warpage suppression and cost reduction.
2Ease of manufacture
If the flexible layer and the rigid layer are bonded on one side, then the flexible product can be formed, but the bonded flexible layer and the rigid layer tend to have a warpage issue in subsequent high-temperature fabrication processes
Solution Approach 1:
The bonding configuration transitions from single-sided bonding to multi-regional bonding with different adhesive properties. By adding the dimension of regional differentiation in bonding strength, the structure can simultaneously achieve flexible product formation and warpage suppression during high-temperature processes.
Solution Approach 2:
The adhesive parameters (presence, absence, or type of adhesive layer) are changed across different regions of the flexible layer. This parameter variation allows the structure to maintain stability during fabrication while enabling easy separation afterward, resolving the warpage issue without compromising manufacturability.
3Adaptability or versatility
If the flexible layer is completely separated from the rigid layer, then flexibility is achieved, but the process becomes difficult and production yield decreases
Solution Approach 1:
The separation process is segmented into selective regions (first and third regions for separation, second region for maintained bonding). This segmentation allows easy separation in designated areas while maintaining structural integrity through bonding in the second region, thereby improving production yield without sacrificing flexibility.
Solution Approach 2:
The adhesive layers act as intermediaries that provide controlled bonding and separation characteristics. Their presence in the second region and absence in the first and third regions create a mediator effect that enables both flexibility and high production yield by facilitating easy separation where needed while maintaining stability where required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The double-sided attachment effect effectively reduces warpage and peeling issues, enabling efficient separation of flexible layers while maximizing the use of substrate area and reducing manufacturing costs, thus enhancing the production yield of flexible modules.
Implementation Method 1
The second portion is attached on the second surface through a first adhesive layer, and the third portion is attached on the second surface through a second adhesive layer
Data Source
AI summary
A prefabricated substrate, a flexible substrate, a flexible module and a fabrication method, and a display device are provided. The prefabricated substrate includes a first film layer as a rigid film layer, and a second film layer as a flexible film layer. The second film layer at least partially wraps the first film layer. The first film layer includes a first surface and a second surface. The second film layer at least includes a first portion located on a side of the first surface away from the second surface, and a second portion and a third portion located on a side of the second surface away from the first surface. The second portion and the third portion are attached on the second surface through a first adhesive layer and a second adhesive layer, respectively. The second portion and the third portion are spaced apart by a gap.