Flexible Substrate Wire Extension for Faster Multi-Circuit Joining
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Solution Overview
Problem
Conventional electrical connection structures for flexible conductive fabrics are time-consuming and cumbersome, requiring independent handling for each circuit connection.
Innovation Solution
A method involving three flexible substrates where conductive wires on two substrates are electrically coupled by a third substrate with conductive wires facing downwards, bonded across a boundary, and secured with a non-conductive sewing thread, allowing for simultaneous electrical and physical coupling of corresponding wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If independent electrical wires are used to connect each circuit one by one, then electrical connection is achieved, but the connection process becomes time-consuming and troublesome
Solution Approach 1:
The patent merges multiple independent wire connections into a single integrated flexible substrate connection. The flexible substrate with conductive wires replaces multiple individual electrical wires, allowing simultaneous connection of multiple circuits in one bonding operation rather than connecting each wire separately.
Solution Approach 2:
The flexible substrate serves multiple functions simultaneously: it acts as both the connection medium and the circuit carrier. The substrate integrates multiple conductive wires into a single component that can establish multiple electrical connections at once, reducing the number of separate connection operations required.
2Adaptability or versatility
If multiple independent electrical wires are used for circuit connections, then each circuit can be connected individually, but the overall connection process becomes cumbersome and complex
Solution Approach 1:
The patent combines multiple individual wire connection operations into a single flexible substrate bonding operation. The flexible substrate integrates multiple conductive traces that correspond to multiple circuits, allowing all connections to be established simultaneously through one bonding process between flexible substrates.
Solution Approach 2:
The patent segments the connection process into modular flexible substrate units. Each flexible substrate can be prepared independently with its conductive wire pattern, then bonded to another substrate to establish connections. This modular approach simplifies the overall complexity by breaking down the connection task into manageable, standardized units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables faster and more efficient connection of conductive wires between flexible substrates, reducing the time and effort required for circuit connections while maintaining electrical integrity.
Implementation Method 1
the corresponding conductive wires between the first and second flexible substrates are electrically coupled with each other through being physically pressed by corresponding conductive wires in the third flexible substrate
Implementation Method 2
The third flexible substrate is flipped over, with its conductive wires facing downwards, and bonded across a boundary formed by the first and second flexible substrates
Data Source
AI summary
The present invention relates to an extension structure of flexible substrates with conductive wires thereon. In a first embodiment, three flexible substrates are prepared, each having multiple conductive wires configured on their front surfaces. The third flexible substrate is flipped over, with its conductive wires facing downwards, and bonded across a boundary formed by the first and second flexible substrates. As a result, the corresponding conductive wires between the first and second flexible substrates are electrically coupled with each other through being physically pressed by corresponding conductive wires in the third flexible substrate.