Flexible Substrate Wire Integration for Reduced Pitch
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Solution Overview
Problem
The increasing structural precision and pixel density of electronic devices lead to challenges in manufacturing and connecting leads of flexible printed circuits (FPC) or chip on film (COF), making it difficult to achieve reliable connections with external circuit boards.
Innovation Solution
The configuration of wires extending from the active area to the peripheral area, partially overlapping the frame portion, with a flexible substrate integrated between the wires and the base, reduces the pitch between wires and simplifies the connection process by changing the connection point to a flexible substrate integrated into the base manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the pixel density and structural precision are increased, then the display quality is improved, but the pitch between leads becomes smaller and manufacturing difficulty increases
Solution Approach 1:
The patent merges the flexible substrate directly into the base structure, eliminating the need for separate lead connections. The flexible substrate is formed as an integral part of the base during the same manufacturing process, allowing high pixel density to be achieved without proportionally increasing lead manufacturing difficulty.
Solution Approach 2:
The flexible substrate serves multiple functions: it acts as both the structural base and the connection medium to external circuit boards. This multi-functionality reduces the number of separate components and manufacturing steps required, addressing the contradiction between high precision and manufacturing ease.
2Manufacturing precision
If the lead pitch is reduced to increase pixel density, then the display resolution is improved, but the connection reliability between electronic device and external circuit board deteriorates
Solution Approach 1:
By merging the flexible substrate with the base structure, the patent creates a unified component that maintains structural integrity even at reduced pitch dimensions. This integration ensures that connection reliability is maintained while achieving higher pixel density through smaller lead pitch.
Solution Approach 2:
The flexible substrate acts as a thin film that provides mechanical support and electrical connection simultaneously. This thin film structure allows for reduced pitch while maintaining connection reliability through its flexibility and integrated design.
3Ease of manufacture
If separate FPC or COF leads are used for connection, then the electronic device can be manufactured, but the manufacturing process becomes more complex and costly
Solution Approach 1:
The patent combines the base and flexible substrate into a single integrated structure, eliminating the need for separate FPC or COF leads. This merging reduces both the number of components and the complexity of the manufacturing process while maintaining all necessary functions.
Solution Approach 2:
The integrated flexible substrate performs multiple functions that previously required separate components, including structural support and electrical connection to external circuit boards. This multi-functionality simplifies the overall device architecture and manufacturing process.
Data Source
AI summary
The disclosure provides an electronic device, including a base, a flexible substrate, and a plurality of wires. The base has an active area and a peripheral area. The flexible substrate is disposed on the peripheral area and the base. The plurality of wires are disposed on the base and the flexible substrate. The plurality of wires extend from the active area to the peripheral area, and the peripheral area partially overlaps the frame portion. The plurality of wires extend along the frame portion to the extension portion. And the flexible substrate is provided between the plurality of wires and the base. The electronic device in the disclosure is conducive to providing smaller wire pitch, reducing the difficulty in connecting the electronic device and the leads of an external circuit board.