Flexible Substrate Wireless Power NFC Module Integration

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Solution Overview

Problem

The integration of NFC and WPC coils with traditional chip installation on motherboards hinders evaluation and debugging, leading to increased product thickness and development time, which contradicts the thinness trend in electronic products.

Innovation Solution

A wireless power consortium device featuring flexible substrates with integrated WPC and NFC coils, modules, and matching circuits, allowing for quick evaluation and debugging, reduced thickness, and separate module evaluation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If NFC and WPC coils are set in the case back cover, then wireless power and NFC functions are achieved, but product thickness is increased

Engineering Contradiction:

Improvewireless power functionVSAvoidproduct thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent combines NFC coils and WPC coils into a single integrated module structure, where both coil types are arranged in the same space rather than being separately installed in the case back cover. This merging approach achieves both wireless power and NFC functions while reducing overall product thickness.

Inventive Principle:

Principle #5Merging (Combining)

2Device complexity

If important chips are installed on the motherboard, then system integration is achieved, but evaluation and debugging time is increased

Engineering Contradiction:

Improvesystem integrationVSAvoiddevelopment time

Core Design Contradiction:

Device complexityVSLoss of time

Solution Approach 1:

The patent segments the system into modular components: an integrated NFC-WPC module and a motherboard with important chips. This segmentation allows the integrated module to be evaluated and debugged separately before final assembly, significantly reducing development time while maintaining system integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The integrated NFC-WPC module is prepared and tested in advance as a pre-assembled unit. This preliminary action allows evaluation and debugging to occur before the module is installed on the motherboard, enabling early detection and resolution of issues without delaying the overall system development.

Inventive Principle:

Principle #10Preliminary action

3Length of stationary object

If NFC and WPC coils are integrated with flexible substrates, then product thickness is reduced, but evaluation and debugging becomes more difficult

Engineering Contradiction:

Improveproduct thicknessVSAvoidevaluation and debugging

Core Design Contradiction:

Length of stationary objectVSEase of operation

Solution Approach 1:

The patent merges NFC and WPC coils into a single integrated module on a flexible substrate, achieving thinness while maintaining ease of evaluation. The integrated design allows both functions to be tested together as one unit, simplifying the debugging process compared to separately evaluating disconnected components.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS10205487B1Wireless power consortium device and method for manufacturing the same

Publication Date: 2019.02.12 AVARY HLDG (SHENZHEN) CO LTD

AI summary

A wireless power consortium device includes a flexible substrate layer, at least one first WPC coil on the flexible substrate layer, at least one first NFC coil on the flexible substrate layer, at least one WPC module, and at least one NFC module. Each WPC module comprises a first matching circuit and a WPC power supply chip electrically connected to the first matching circuit. Each NFC module comprises a second matching circuit and an NFC controlling chip electrically connected to the second matching circuit. The first matching circuit and the second matching circuit are different parts of one circuit and are formed on the flexible substrate layer.