Flexible Electronic Structure Support Pads for Bonding Planarity

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Solution Overview

Problem

Flexible electronic structures, such as flexible ICs, face distortion and damage during the bonding process due to the wide spaces between contacts, leading to loss of planarity and reduced control over the form of the flexible circuit.

Innovation Solution

Incorporating support elements on the flexible electronic structure that contact corresponding surface elements on the external structure, providing mechanical support and maintaining planarity during bonding, while also potentially offering optical shielding, electromagnetic interference shielding, and thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional bonding process is used with wide spaces between contacts, then bonding can be performed, but the flexible circuit structure becomes distorted and loses planarity

Engineering Contradiction:

Improvebonding processVSAvoidplanarity

Core Design Contradiction:

Ease of manufactureVSShape

Solution Approach 1:

The support structure is segmented into multiple discrete support elements (support pads, support fingers) distributed across the flexible circuit. These segmented support elements provide localized mechanical support during bonding without requiring continuous support across the entire circuit area, thus maintaining planarity while enabling the bonding process.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support elements act as intermediary structures between the bonding process and the flexible circuit. During bonding, these support elements contact corresponding surfaces on the bonding tool or substrate, providing mechanical support and preventing distortion of the flexible circuit while allowing the bonding process to proceed.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If the flexible circuit structure is made thinner and more flexible, then it can be bent and stretched while maintaining integrity, but it becomes more vulnerable to damage without protective casing

Engineering Contradiction:

ImproveflexibilityVSAvoiddamage resistance

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent employs a flexible protective layer or coating on the flexible circuit structure that maintains the thin and flexible nature of the circuit while providing mechanical protection. This protective film allows the circuit to be bent and stretched while preventing damage to the underlying electronic components and conductors.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The support elements are positioned on the flexible circuit before the bonding process begins. These support elements provide preemptive mechanical reinforcement to vulnerable areas of the flexible circuit, cushioning them against potential damage during the bonding operation and subsequent handling.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Shape

If support elements are added to maintain planarity during bonding, then distortion is prevented, but device complexity increases

Engineering Contradiction:

Improveplanarity controlVSAvoidstructure

Core Design Contradiction:

ShapeVSDevice complexity

Solution Approach 1:

The support elements are merged with existing features of the flexible circuit structure, such as using the same flexible substrate material or integrating support pads with existing contact pads. This merging approach provides the necessary planarity control while minimizing the increase in device complexity by reusing existing structural elements.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The support elements are designed to serve multiple functions: they provide mechanical support during bonding, maintain planarity of the flexible circuit, and can also serve as bonding surfaces or electrical contacts. This multi-functionality reduces the need for separate dedicated support structures, thereby limiting the increase in device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS12237289B2Flexible electronic structure including a support element

Publication Date: 2025.02.25 PRAGMATIC SEMICON LTD

AI summary

There is provided a flexible electronic structure for bonding with an external circuit. The flexible electronic structure comprising: a flexible body having a first surface, the flexible body comprising at least one electronic component; at least one contact element configured to bond with the external circuit, the at least one contact element operatively coupled with the at least one electronic component and provided at the first surface of the flexible body, and arranged to operably interface with the external circuit after bonding, and at least one support element provided at the first surface of the flexible body, each support element arranged to contact a corresponding surface element disposed on a first surface of an external structure comprising the external circuit.