Flexible Support Substrate for Semiconductor Die Transfer
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Solution Overview
Problem
Conventional semiconductor device fabrication processes result in packaged devices that are larger and more prone to damage during transfer due to exerted forces, leading to potential failure of the product.
Innovation Solution
A machine and process that utilize a flexible support substrate to dampen forces during the transfer of unpackaged semiconductor die from a wafer tape to a product substrate, minimizing stress and strain through deflection and precise alignment mechanisms, and secure the product substrate using adhesive, mechanical, or releasable means.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor devices are packaged before transfer, then they are protected from environmental damage, but the device size and thickness increase significantly
Solution Approach 1:
The patent extracts the protective packaging from the final product configuration and replaces it with a transfer-specific protective mechanism. The flexible support substrate provides protection during transfer operations without requiring the die to be enclosed in a package, thereby maintaining thin profile while ensuring protection during handling.
Solution Approach 2:
The flexible support substrate serves as a pre-positioned cushioning mechanism that protects the die during transfer operations. The substrate's flexibility allows it to absorb and distribute forces applied during pick-and-place operations, providing beforehand protection without adding package-level thickness.
2Productivity
If unpackaged die are transferred directly, then manufacturing time and cost are reduced, but the die are more prone to damage from exerted forces
Solution Approach 1:
The flexible support substrate acts as an intermediary between the transfer mechanism and the die. It mediates the interaction by providing a compliant surface that reduces peak forces during transfer, thereby protecting the die while enabling direct transfer without packaging.
Solution Approach 2:
The patent changes the mechanical parameter of the support structure from rigid to flexible. This parameter change allows the substrate to dynamically adapt to transfer forces, reducing stress concentrations that could damage the die while maintaining the efficiency of direct unpackaged transfer.
3Manufacturing precision
If rigid support substrate is used, then alignment precision is maintained, but forces during transfer cause damage to die and substrate
Solution Approach 1:
The patent employs a flexible support substrate that combines the alignment capabilities of rigid structures with the force-dampening properties of flexible materials. The flexible substrate maintains precise alignment through its structural design while simultaneously reducing transfer forces through its compliance.
Solution Approach 2:
The flexible support substrate represents a composite solution that integrates structural integrity for alignment with material compliance for force reduction. This composite approach allows the single substrate to fulfill both alignment precision and damage prevention functions simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for direct transfer of semiconductor die without packaging, reducing the thickness and manufacturing time and cost of the end product while preventing damage to the die and substrate, resulting in a more reliable and efficient manufacturing process.
Implementation Method 1
A machine and process that utilize a flexible support substrate to dampen forces during the transfer of unpackaged semiconductor die from a wafer tape to a product substrate, minimizing stress and strain through deflection
Data Source
AI summary
An apparatus for transferring a semiconductor die from a wafer tape to a product substrate. The apparatus includes a wafer frame configured to secure the wafer tape and a support frame configured to secure a support substrate. The support substrate includes a plurality of holes and secures the product substrate. The apparatus further includes an actuator to transfer the semiconductor die to a transfer location on the product substrate.