Flexible Temperature Sensor Using Fine-Particle Thermistor
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Solution Overview
Problem
Current temperature sensors face challenges in achieving high B constants and flexibility, particularly in compact electronic devices where size reduction and performance enhancement are required, while maintaining thermistor characteristics and preventing cracks when bent.
Innovation Solution
A temperature sensor is developed using a spinel-type semiconductor ceramic composition powder containing Mn, Ni, and Fe, with a specific molar ratio and average particle size of 2 μm or less, combined with an organic polymer component, to achieve high B constants and flexibility, and a method involving grinding and heat treatment of raw materials to form a thermistor layer on a flexible substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the amount of semiconductor ceramic composition is increased to improve thermistor characteristics, then the B constant is improved, but the flexibility of the thermistor material deteriorates
Solution Approach 1:
The patent changes the particle size parameter of the semiconductor ceramic composition to 2 μm or less, which allows achieving high B constants while maintaining flexibility. This parameter change resolves the contradiction by enabling sufficient thermistor characteristics with reduced semiconductor ceramic content, thereby preserving flexibility.
Solution Approach 2:
The patent uses a composite material system consisting of fine semiconductor ceramic composition particles (2 μm or less) dispersed in an organic polymer matrix. This composite structure allows the thermistor material to achieve both high B constant and flexibility, as the fine particles provide thermistor characteristics while the polymer matrix maintains flexibility.
2Volume of moving object
If the size of electronic devices is reduced, then the compactness is improved, but the performance enhancement becomes more difficult to achieve
Solution Approach 1:
By changing the particle size parameter to 2 μm or less, the patent enables high B constants to be achieved in compact form factors. The fine particle size allows sufficient thermistor performance in smaller volumes, resolving the contradiction between device size reduction and performance maintenance.
3Adaptability or versatility
If the thermistor material is made flexible, then the adaptability is improved, but the B constant decreases
Solution Approach 1:
The patent resolves this contradiction by changing the particle size parameter to 2 μm or less, which enables the thermistor material to achieve both flexibility and high B constant. The fine particle size allows the material to maintain flexibility while achieving sufficient thermistor characteristics with reduced semiconductor ceramic content.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a temperature sensor with a high B constant of 2500 K or higher and minimal variation, excellent flexibility, and reduced risk of cracking, enabling effective temperature sensing in compact electronic devices.
Implementation Method 1
The thermistor material usually includes a semiconductor ceramic composition powder which has thermistor characteristics
Implementation Method 2
it is necessary for the thermistor material formed on the flexible substrate to have flexibility
Implementation Method 3
grinding a raw material mixture containing powders of a Mn source, a Ni source, and a Fe source
Implementation Method 4
subjecting the ground raw material mixture to a heat treatment at a temperature of 700° C. to 900° C.
Data Source
AI summary
A temperature sensor that includes a first electrode layer, a second electrode layer, and a thermistor layer between the first and second electrode layers. The thermistor layer includes a spinel-type semiconductor ceramic composition powder containing Mn, Ni, and Fe, and an organic polymer component. In the semiconductor ceramic composition powder, the molar ratio of Mn to Ni is 85/15≥Mn/Ni≥65/35, and when the total molar quantity of Mn and Ni is 100 parts by mole, the content of Fe is 30 parts by mole or less, and the semiconductor ceramic composition powder is 2 μm or less in particle size.