Flexible Textile Circuits with Laser-Etched Metallized Mesh

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Solution Overview

Problem

Existing methods for producing flexible circuits, such as chemical etching, face challenges in achieving precise patterns, mechanical strength, and adaptability for diverse applications, particularly in miniaturization and integration with textile substrates.

Innovation Solution

A flexible circuit based on a synthetic single-thread square mesh precision fabric with a conductive pattern, utilizing metal coating techniques like sputtering, galvanic deposition, and laser etching to ensure high mechanical strength, precision, and adaptability, while maintaining evenness and permeability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If chemical etching process is used to create conductive patterns on metallized fabric, then the circuit pattern can be formed, but the manufacturing precision and pattern quality are compromised

Engineering Contradiction:

Improvepattern qualityVSAvoidchemical etching complexity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent replaces the chemical etching process with a mechanical cutting process. A cutting tool physically cuts through the metallized fabric layers to create conductive traces, eliminating the need for chemical masks, etching baths, and stripping processes. This mechanical approach provides superior edge definition and pattern precision while simplifying the manufacturing workflow.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention extracts and removes the chemical processing steps (mask application, UV exposure, chemical etching, mask stripping) from the manufacturing process, retaining only the essential pattern formation step through mechanical cutting. This extraction eliminates the harmful chemical reactions and multiple process stages while maintaining pattern creation capability.

Inventive Principle:

Principle #2Taking out (Extraction)

2Productivity

If photolithographic process is used for pattern transfer, then conductive patterns can be formed, but the process complexity and number of steps increase

Engineering Contradiction:

Improvepattern formation efficiencyVSAvoidphotolithographic process steps

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the entire photolithographic process sequence (resist coating, UV exposure through masks, chemical development, chemical etching, resist stripping) and replaces it with a single mechanical cutting operation. This dramatically reduces process complexity from multiple sequential steps to one straightforward cutting step.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention substitutes the optical-chemical photolithographic system with a direct mechanical cutting system. Instead of using UV light to chemically alter resist material and subsequently chemically etch the metal, the process directly mechanically cuts the metallized fabric layers to form conductive traces in a single operation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Strength

If conventional metallized fabric is used, then flexible circuits can be created, but mechanical strength and structural integrity are reduced

Engineering Contradiction:

Improvemechanical strengthVSAvoidcircuit application range

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The patent employs composite material construction with multiple layers of metallized fabric stacked and bonded together. This composite structure provides enhanced mechanical strength, structural integrity, and dimensional stability compared to single-layer fabrics, while maintaining the flexibility and conformability needed for various circuit applications.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The invention uses flexible metallized fabric layers as the base material, which combines the mechanical properties of textile fabrics with the electrical conductivity of metal coatings. These flexible thin film structures maintain bendability and conformability while providing the structural integrity needed for reliable circuit operation in diverse applications.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enables the creation of flexible circuits with improved mechanical strength, precision, and adaptability, allowing for miniaturization and integration of electronic components, suitable for various applications without compromising the fabric's inherent properties.

Implementation Method 1

A further method according to the invention consists in making a flexible circuit on a textile base, comprising the steps of: a) making a metallized fabric by depositing a metal material on the textile base

Methodology Applied

Scientific EffectSputtering: Sputtering

Implementation Method 2

Methodology Applied

Scientific EffectGalvanic deposition: Electrodeposition

Implementation Method 3

b) removing excess metal from the metallized fabric by the action of a laser beam

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS10173284B2Method for making flexible circuits

Publication Date: 2019.01.08 SAATI SPA

AI summary

A method for removing a metal from a single-thread fabric for making a pattern, characterized in that said single-thread fabric is a square-mesh metallized and etching laser made fabric.