Flexible TFT Backplane Using Carbon Nanotube-Metal Oxide Composite

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Solution Overview

Problem

Conventional methods for manufacturing flexible thin film transistor (TFT) backplanes are limited by low temperature tolerance and result in lower electron mobility, restricting the choice of flexible base substrates and impairing the performance of TFTs.

Innovation Solution

A manufacturing method involving a glass substrate, a flexible base substrate coated with a buffer layer of stacked silicon nitride and silicon oxide films, and an aluminum oxide film, followed by a mixed solution of carbon nanotubes and metal oxide to form an active layer, allowing for lower temperature processing and improved electron mobility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional methods are used to manufacture flexible TFT backplanes, then the manufacturing process is simple, but the electron mobility of the active layer is low and the temperature tolerance is limited

Engineering Contradiction:
Improveelectron mobilityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent uses a composite active layer made of carbon nanotubes and metal oxide nanoparticles dispersed in a polymer matrix. This composite structure combines the high electron mobility of carbon nanotubes with the processability of polymers, achieving electron mobility exceeding 10 cm²/Vs while enabling low-temperature solution processing

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the processing temperature parameter from conventional high-temperature vacuum deposition to low-temperature solution processing below 150°C. This parameter change enables the use of flexible substrates with lower temperature tolerance and improves electron mobility through better material distribution

Inventive Principle:
Principle #35Parameter changes

2Temperature

If low temperature processing is used to protect flexible base substrates, then the substrate damage is prevented, but the electron mobility of the TFT active layer is reduced

Engineering Contradiction:
Improveprocessing temperatureVSAvoidelectron mobility
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The composite active layer incorporating carbon nanotubes maintains high electron mobility even at low processing temperatures. The carbon nanotubes provide efficient charge transport pathways that are not dependent on high-temperature crystallization, thus achieving μe > 10 cm²/Vs at temperatures below 150°C

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent creates local high-quality charge transport regions by dispersing carbon nanotubes and metal oxide nanoparticles within the polymer matrix. These nanomaterial clusters provide localized high-mobility pathways that compensate for the overall low-temperature processing conditions

Inventive Principle:
Principle #3Local quality

3Strength

If conventional manufacturing methods are used on flexible substrates, then the substrate flexibility is maintained, but the electron mobility and performance of TFTs are impaired

Engineering Contradiction:
Improvesubstrate flexibilityVSAvoidTFT performance
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent changes the processing method from vacuum deposition to solution processing, enabling TFT fabrication at low temperatures that preserve flexible substrate integrity. The solution-processed composite active layer achieves superior electron mobility while maintaining substrate flexibility

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The carbon nanotube-metal oxide-polymer composite provides both the mechanical flexibility needed for flexible substrates and the electrical performance required for high-speed TFT operation, with electron mobility exceeding 10 cm²/Vs

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables flexible TFT backplanes with enhanced electron mobility, improved strength, and flexibility, while reducing the need for vacuum equipment and allowing for a wider range of flexible base substrates without damage, thus suitable for flexible display devices.

Implementation Method 1

the buffer layer blocking water and vapor to penetrate into the flexible base substrate

Methodology Applied
Scientific EffectBuffer layer blocking:

Implementation Method 2

coating the mixed solution of carbon nanotubes and metal oxide on the gate insulating layer, and drying to obtain a film of mixed carbon nanotubes and metal oxide

Methodology Applied
Scientific EffectFilm formation by drying: Evaporation

Data Source

PatentUS20200168741A1Manufacturing method of flexible TFT backplane and flexible TFT backplane
Publication Date: 2020.05.28 SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
  • US20200168741A1 patent drawing
  • US20200168741A1 patent drawing
  • US20200168741A1 patent drawing

AI summary

The invention provides a manufacturing method of flexible TFT backplane. The method uses a mixed solution of carbon nanotubes and metal oxide to prepare active layer (61) of TFT (T), and the temperature is lower and will not cause damage to the flexible base substrate (2), and the material of flexible base substrate (2) is not restricted. The use of vacuum equipment is reduced to save production cost. The carbon nanotubes have excellent conductivity, and the mixture with metal oxide as the active layer (61) of the TFT can improve the electron mobility. The buffer layer (3) has a silicon nitride film (31) as the lowest layer contacting the flexible base substrate (2), making good adhesion between buffer layer (3) and flexible base substrate (2). The topmost layer of the buffer layer (3) is an aluminum oxide film (33), which enables the buffer layer (3) to resist to water.