Flexible Thermal Management Assembly for Expansion Mismatch

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Solution Overview

Problem

The relative displacement between the flow channel component and the box body due to differing expansion coefficients leads to disconnection issues in the electrical connection between the sensor and control component in thermal management assemblies.

Innovation Solution

Incorporation of a flexible connecting component, such as a flexible circuit board, that is deformable to accommodate differential expansion, reducing stress and maintaining stable connections between the sensor and control components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If rigid electrical connections are used between sensor and control component, then electrical connection stability is improved, but thermal expansion mismatch causes disconnection

Engineering Contradiction:

Improveelectrical connection stabilityVSAvoidthermal expansion adaptability

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent uses a flexible circuit board instead of rigid electrical connections. The flexible circuit board can deform elastically to accommodate the relative displacement caused by differential thermal expansion between the flow channel component and box body, while maintaining continuous electrical connection between the sensor and control component.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the physical state of the electrical connection from rigid to flexible. The flexible circuit board's ability to change its shape and absorb displacement through elastic deformation allows it to adapt to thermal expansion differences while maintaining electrical connectivity.

Inventive Principle:

Principle #35Parameter changes

2Adaptability or versatility

If different materials are used for flow channel component and box body, then functional performance is improved, but relative displacement occurs due to expansion difference

Engineering Contradiction:

Improvematerial selection flexibilityVSAvoidrelative position stability

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The flexible circuit board acts as an intermediary element between the sensor (fixed to flow channel component) and the control component (fixed to box body). It absorbs the relative displacement caused by different thermal expansion coefficients of the materials, allowing both materials to maintain their functional advantages while preventing connection failure.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Device complexity

If thermal management assembly is miniaturized, then integration level is improved, but connection reliability becomes more difficult to ensure

Engineering Contradiction:

Improveintegration levelVSAvoidconnection reliability

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The flexible circuit board provides a compact solution for maintaining reliable electrical connections in miniaturized assemblies. Its flexibility allows it to accommodate thermal stresses in compact spaces where rigid connections would be prone to failure, thus enabling miniaturization without sacrificing connection reliability.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The flexible connecting component ensures reliable and stable electrical connections by minimizing relative displacement and stress, facilitating a high integration level and miniaturization of the thermal management assembly.

Implementation Method 1

The materials of the flow channel component and the box body are usually different. The difference between the expansion degree of the flow channel component and the expansion degree of the box body causes relative displacement between the flow channel component and the box body

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

a flexible connecting component, one end of the flexible connecting component being electrically connected to the sensor, and another end of the flexible connecting component being electrically connected to the control component. The flexible connecting component is deformable

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentEP4501672B1Thermal management assembly with flexible connecting component

Publication Date: 2026.03.25 ZHEJIANG SANHUA INTELLIGENT CONTROLS CO LTD

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AI summary

A thermal management assembly includes a flow channel component, a box body (12), a sensor (13), a control component (14) and a flexible connecting component (15). The flow channel component has a first expansion coefficient. The box body has a second expansion coefficient different from the first expansion coefficient. The sensor and the flow channel component are fixedly connected. The control component and the box body are fixedly connected. One end of the flexible connecting component (15) is electrically connected to the sensor (13), and another end of the flexible connecting component is electrically connected to the control component (14). The flexible connecting component is deformable, thereby reducing a relative displacement between the flow channel component and the box body due to different degrees of expansion when the thermal management assembly is operating.