Flexible Thermal Bridge for Data Storage Hot Spot Cooling

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Solution Overview

Problem

Data storage devices in high-capacity digital systems experience localized elevated temperatures, known as 'hot spots,' which reduce read/write performance when they reach a throttling point, necessitating a more efficient cooling mechanism beyond traditional cooling fans.

Innovation Solution

A thermally conductive thermal bridge is positioned between data storage devices and a cooler structure within the enclosure, constructed from materials like copper or Pyrolytic Graphite Sheet, to conduct heat away and facilitate convection, while being flexible and adjustable to accommodate varying gaps and maintain air flow, functioning as a compression spring to generate contact forces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional cooling fans are used to reduce hot spot temperature, then temperature reduction is achieved, but power consumption increases

Engineering Contradiction:

Improvehot spot temperatureVSAvoidpower consumption

Core Design Contradiction:

TemperatureVSUse of energy by moving object

Solution Approach 1:

The patent replaces the mechanical cooling fan system with a passive thermal bridge structure that utilizes thermal conduction and natural convection. The thermal bridge, made of thermally conductive material, directly conducts heat from the hot spot to a cooler surface, eliminating the need for powered mechanical cooling components.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The thermal bridge acts as an intermediary element between the hot spot (data storage device) and the cooler enclosure surface. This intermediate thermally conductive structure facilitates heat transfer without requiring direct contact between the hot device and the cooling mechanism, enabling passive heat dissipation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If rigid thermal contact structures are used, then thermal conduction is improved, but air flow is blocked and adaptability decreases

Engineering Contradiction:

Improvehot spot temperatureVSAvoidadaptability to varying gaps

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The thermal bridge is constructed from a flexible thermally conductive material that can conform to varying gaps and surfaces. This flexibility allows the thermal bridge to maintain effective thermal contact across different device positions and enclosure configurations without requiring rigid structural adjustments.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The thermal bridge incorporates dynamic adaptability through its flexible nature, allowing it to adjust its shape and contact pressure in response to varying gaps between the data storage device and enclosure surface. This dynamic adaptation maintains optimal thermal conduction across different operating conditions.

Inventive Principle:

Principle #15Dynamics

3Temperature

If rigid thermal contact structures are used, then thermal conduction is improved, but device complexity increases

Engineering Contradiction:

Improvehot spot temperatureVSAvoidcooling mechanism complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent extracts the active cooling function (fan) and replaces it with a passive thermal bridge structure. This simplification removes complex mechanical components, control systems, and power management requirements, leaving only the essential thermal conduction function implemented through a simple flexible bridge.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The thermal bridge operates autonomously without requiring external control or power. The flexible structure self-adjusts to maintain thermal contact, and the heat dissipation process occurs naturally through thermal conduction and convection, eliminating the need for complex control mechanisms.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces the temperature of hot spots by 10%-18% without increasing power consumption or costs, providing a versatile and cost-effective cooling method for data storage systems.

Implementation Method 1

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

positioned between data storage devices and a cooler structure within the enclosure, constructed from materials like copper or Pyrolytic Graphite Sheet, to conduct heat away and facilitate convection

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS11429163B2Hot spot cooling for data storage system

Publication Date: 2022.08.30 SANDISK TECHNOLOGIES LLC

AI summary

A data storage system may include multiple data storage devices, such as solid-state drives, an enclosure housing the devices, and a thermal bridge positioned in a gap between and in contact with each of the enclosure and a device, where the enclosure is cooler than the device. Thus, heat is conducted away from a hot spot of the device and to the enclosure. The thermal bridge may be flexible enough to bridge different sized gaps, while stiff enough to generate contact forces applied to the enclosure and the device. For example, the thermal bridge may be constructed primarily of copper and configured to function like a compression spring.