Flexible Thermal Coupling for Multi-Height Components

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Solution Overview

Problem

Existing cooling devices struggle to thermally couple heat-generating components of different heights with heat dissipation sections effectively, leading to inefficient heat transfer and potential temperature rises.

Innovation Solution

A cooling device design featuring first and second heat dissipation sections thermally coupled with heat-generating components, a frame with openings, and flexible connecting sections that press the heat dissipation sections towards the components, ensuring stable thermal coupling regardless of height differences.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a predetermined clearance is set between the upper parts of electronic components and the heat dissipater, then the heat dissipater can cover multiple components, but some components may not be thermally coupled if the clearance and sheet thickness are not properly set

Engineering Contradiction:

Improvecoverage of heat dissipaterVSAvoidthermal coupling stability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent uses a flexible sheet (silicone sheet or elastic rubber) to fill the clearance between the heat dissipater and electronic components of varying heights. The sheet's flexibility allows it to conform to different component heights while maintaining thermal contact, ensuring reliable thermal coupling across all components regardless of height differences.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent employs elastic rubbers with different hardness values (shore A 60-90) to adapt to different thermal coupling requirements. By selecting appropriate hardness parameters, the elastic rubber can effectively fill clearances of varying sizes and maintain stable thermal contact between the heat dissipater and components of different heights.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If a silicon sheet is placed in the clearance to thermally couple components and heat dissipater, then thermal coupling is achieved, but the coupling is unstable when components have different heights

Engineering Contradiction:

Improvethermal couplingVSAvoidaccommodation of height differences

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The flexible sheet (silicone or elastic rubber) can deform to accommodate components of different heights while maintaining continuous thermal contact. This flexibility allows the same thermal coupling mechanism to work reliably across components with varying heights, solving the adaptability problem.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The elastic rubber provides dynamic adaptation through its elasticity, allowing the thermal coupling system to adjust to different component heights. The material can be compressed and deformed to maintain contact pressure and thermal coupling stability regardless of the specific height configuration of mounted components.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design ensures stable thermal coupling and efficient heat dissipation, even when components have varying heights, by compressing flexible connecting sections to reduce thermal resistance and prevent temperature increases.

Implementation Method 1

first and second flexible connecting sections provided at peripheries of the first and second openings, respectively, the first and second connecting sections respectively connecting the first and second heat dissipation sections and the frame

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

first and second heat dissipation sections that are thermally coupled with the first and second heat-generating components, respectively

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9740251B2Cooling device and device

Publication Date: 2017.08.22 CLOUD BYTE LLC

AI summary

First and the second heat dissipation sections 120a and 120b are thermally coupled with a memory 220 and a CPU 230 mounted on a surface of a substrate 210, respectively. A frame 130 is arranged above the surface of the substrate. First and second openings 131a and 131b are formed at the positions corresponding to the positions at which the first and second heat dissipation sections 120a are provided in the frame 130. First and second elastic rubbers 150a and 150b (first and second connecting sections) are provided at periphery of the first and second openings. The first and second elastic rubbers connect the first and second heat dissipation sections and the frame, respectively. With this configuration, each of a plurality of heat-generating components is thermally coupled with each of a plurality of heat dissipation sections stably, even when the plurality of heat-generating components have different heights.