Flexible Thermal Ground Plane with Micro-Nanowicking
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Solution Overview
Problem
Existing heat pipes for cooling integrated circuits are rigid and limited in flexibility and heat dissipation capacity, which restricts the size and complexity of modern electrical devices that require flexible circuit boards with high heat dissipation capabilities.
Innovation Solution
A flexible thermal ground plane system is developed using a polymer casing with moisture barrier coatings, incorporating micro- and nanowicking structures, and high thermal conductivity materials, enabling efficient heat transfer and large-scale manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rigid heat pipe structures are used, then heat transfer efficiency is improved, but flexibility and adaptability are worsened
Solution Approach 1:
The patent applies flexible shells and thin films by using a flexible polymer substrate instead of rigid metal structures. The vapor chamber is formed by sealing edges of a flexible polymer sheet, creating a flexible enclosure that can conform to curved surfaces and flexible circuit boards while maintaining thermal performance through phase change heat transfer mechanisms.
Solution Approach 2:
The patent employs composite materials by combining flexible polymer substrates with phase change working fluids and wicking structures. The flexible polymer provides structural flexibility while the phase change material (liquid/vapor) provides high heat transfer efficiency, creating a composite system that achieves both flexibility and thermal performance.
2Productivity
If large size flexible thermal ground planes are manufactured, then productivity and cost-effectiveness are improved, but manufacturing precision and quality control are worsened
Solution Approach 1:
The patent applies universality by designing a standardized flexible vapor chamber structure that can be manufactured in large sizes using continuous processing methods. The flexible polymer substrate and sealing edge design allow for scalable production while maintaining consistent thermal performance across different sizes, enabling both high productivity and quality control.
3Adaptability or versatility
If flexible polymer casing is used, then flexibility is improved, but moisture barrier performance is worsened
Solution Approach 1:
The patent uses composite materials by combining flexible polymer substrates with phase change material (liquid/vapor) and wicking structures. The flexible polymer provides structural flexibility while the phase change material (liquid/vapor) provides high heat transfer efficiency, creating a composite system that achieves both flexibility and thermal performance.
Solution Approach 2:
The patent applies flexible shells and thin films by using a flexible polymer substrate instead of rigid metal structures. The vapor chamber is formed by sealing edges of a flexible polymer sheet, creating a flexible enclosure that can conform to curved surfaces and flexible circuit boards while maintaining thermal performance through phase change heat transfer mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible thermal ground plane achieves high thermal performance with enhanced evaporation and condensation heat transfer, supporting large-scale and flexible thermal management for modern electrical devices, with improved manufacturing efficiency and cost-effectiveness.
Implementation Method 1
The evaporator region may include a micro-wicking structure. The evaporator region may include a nanowicking structure coupled with the micro-wicking structure
Implementation Method 2
An evaporator region may be coupled to the flexible support member. The evaporator region may include a micro-wicking structure
Implementation Method 3
extremely high thermal performance with high evaporation/condensation heat transfer
Implementation Method 4
One or more condenser regions may couple with the flexible support. high evaporation/condensation heat transfer
Implementation Method 5
A flexible thermal ground plane may include a support member. The evaporator region may be coupled to the flexible support member
Data Source
AI summary
Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.