Flexible Thermal Interface for Non-Planar Surfaces

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Solution Overview

Problem

Conventional heat sinks and thermal management devices are inadequate for components with non-planar surfaces, as they fail to effectively transfer heat due to their rigid design, which limits their applicability to components with varying topographies.

Innovation Solution

A thermal management device featuring a flexible contact surface with independently movable segments, coupled to a heat sink via a flexible support element, such as a bellows, that can deform to conform to non-planar surfaces and includes a fluid reservoir with a working fluid that vaporizes and condenses to efficiently transfer heat through latent heat of boiling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a rigid heat sink design is used, then manufacturing precision and structural stability are improved, but adaptability to non-planar surfaces deteriorates

Engineering Contradiction:

Improveheat sink manufacturing precisionVSAvoidadaptability to non-planar surfaces

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The contact surface is divided into multiple independently movable segments that can individually adjust to match the contours of non-planar surfaces. Each segment is coupled to the heat sink body through flexible support elements, allowing local deformation while maintaining overall structural integrity and thermal conduction pathways.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The contact surface transitions from a rigid static structure to a dynamic adaptive structure. The segments can move and deform in response to surface topology variations, enabling the heat sink to conform to three-dimensional component surfaces while maintaining effective thermal contact.

Inventive Principle:

Principle #15Dynamics

2Adaptability or versatility

If a flexible contact surface with movable segments is used, then adaptability to non-planar surfaces is improved, but device complexity increases

Engineering Contradiction:

Improveadaptability to non-planar surfacesVSAvoidthermal management device complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Flexible support elements such as bellows are used to couple the movable segments to the heat sink body. These flexible elements provide the necessary deformation capability while maintaining structural support and thermal conduction, reducing the need for complex mechanical actuation systems.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The thermal management device utilizes the natural thermal expansion and contraction of materials, as well as gravitational forces, to enable the flexible segments to self-adjust and maintain contact with the heat-generating component surface without requiring external control systems or continuous actuation.

Inventive Principle:

Principle #25Self-service

3Stability of the object's composition

If conventional rigid cooling systems are used, then structural stability is improved, but thermal management effectiveness for complex geometries deteriorates

Engineering Contradiction:

Improvestructural stabilityVSAvoidcomponent temperature control

Core Design Contradiction:

Stability of the object's compositionVSTemperature

Solution Approach 1:

The cooling system is segmented into multiple independent contact regions that can individually adapt to complex geometries. This segmentation allows each region to maintain stable thermal contact with varying surface topologies, ensuring effective heat removal from components with non-planar surfaces while preserving overall structural stability.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for reliable thermal communication between heat-generating components with complex geometries and a heat sink, effectively cooling components before they reach damaging temperatures, and can be reused without continuous force, maintaining thermal connection during vibrations and maintenance.

Implementation Method 1

a working fluid that vaporizes and condenses to efficiently transfer heat through latent heat of boiling

Methodology Applied

Scientific EffectLatent heat of boiling: Latent Heat

Implementation Method 2

a working fluid in the fluid reservoir... configured to exhaust heat from the single-phase working fluid... configured to exhaust heat from the dual-phase working fluid

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 3

a movable contact surface configured to transfer heat from a heat-generating component to the working fluid

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250107046A1Systems and methods for thermal management of electronic devices

Publication Date: 2025.03.27 MICROSOFT TECHNOLOGY LICENSING LLC

AI summary

A device may include a heat sink body defining a fluid reservoir. A device may include a working fluid in the fluid reservoir. A device may include a movable contact surface configured to transfer heat from a heat-generating component to the working fluid, wherein at least a portion of the movable contact surface is movable relative to the heat sink body.