Flexible Thermally Conductive Sheet with Reduced Adhesive Area
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Solution Overview
Problem
Conventional thermally conductive sheets fail to effectively dissipate heat in compact electronic devices due to their rigidity, which prevents close contact with heat-emitting bodies, leading to inadequate thermal diffusion and potential damage from heat accumulation.
Innovation Solution
A thermally conductive sheet comprising a thermally conductive polymer layer with a low coefficient of static friction, an adhesive layer, and a thermal diffusion layer, where the adhesive layer is smaller than the polymer layer, allowing for improved adhesion and thermal conductivity while preventing excessive adhesiveness and thermal contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal diffusion sheet made of graphite or metal material is used to effectively diffuse heat, then thermal diffusion properties are improved, but the rigidity of the material prevents close contact with heat emitting bodies, resulting in increased thermal contact resistance
Solution Approach 1:
The patent applies this principle by using a flexible polymer layer as the base material instead of rigid graphite or metal. This polymer layer can conform to the contour of heat emitting bodies, ensuring close contact and reducing thermal contact resistance while maintaining thermal diffusion capabilities through the addition of thermally conductive fillers.
Solution Approach 2:
The patent applies this principle by creating a composite structure consisting of a polymer layer combined with thermally conductive filler particles. This composite material achieves both flexibility (from the polymer matrix) and high thermal conductivity (from the filler particles), resolving the contradiction between rigidity and conformability.
2Reliability
If the adhesive layer has the same outer shape as the thermally conductive polymer layer, then adhesion coverage is maximized, but excessive adhesiveness increases thermal contact resistance and reduces ease of handling
Solution Approach 1:
The patent applies this principle by making the adhesive layer's properties non-uniform: the outer shape is smaller than the polymer layer to reduce overall adhesiveness and improve handling, while the adhesive material itself has high bonding strength to ensure reliable attachment where needed. This creates different functional zones within the same component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sheet enhances heat dissipation by allowing close contact with heat-emitting bodies, reducing thermal resistance, and improving ease of handling, thus effectively cooling electronic devices without compromising thermal conductivity.
Implementation Method 1
The thermally conductive polymer composition contains a polymer matrix and a thermally conductive filler
Implementation Method 2
an adhesive layer provided on an outer surface of the thermally conductive polymer layer
Data Source
AI summary
A thermally conductive sheet comprises a thermally conductive polymer layer, an adhesive layer provided on an outer surface of the thermally conductive polymer layer, and a thermal diffusion layer, which is a functional layer provided on the adhesive layer. The thermally conductive polymer layer is formed of a thermally conductive polymer composition containing a polymer matrix and a thermally conductive filler. The coefficient of static friction of the thermally conductive polymer layer is 1.0 or lower. The adhesive layer has an outer shape smaller than that of the thermally conductive polymer layer.