Flexible Thermal Spreader with Embedded Cooling Loop
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Solution Overview
Problem
Current thermal spreaders lack the desired level of performance in terms of mechanical flexibility and effective thermal conductivity, leading to inefficiencies in heat transfer and potential corrosion issues with electrically-conductive liquids.
Innovation Solution
A mechanically flexible thermal spreader with an embedded cooling loop and integrated rigid metal inserts, utilizing a pump to circulate electrically-conductive liquid, and coated with alkali silicate glass to prevent corrosion, allowing for efficient thermal energy transfer between a heat source and a heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a rigid metal thermal spreader is used, then thermal conductivity is improved, but mechanical flexibility deteriorates
Solution Approach 1:
The patent employs a composite structure combining a flexible substrate (polyimide or silicone rubber) with embedded rigid metal inserts (aluminum or copper). This composite approach allows the thermal spreader to maintain mechanical flexibility from the substrate while achieving high thermal conductivity through the metal inserts that serve as heat spreaders and thermal pathways.
2Temperature
If an electrically-conductive liquid is used for cooling, then heat transfer efficiency is improved, but corrosion risk increases
Solution Approach 1:
The patent introduces alkali silicate glass coating as an intermediary barrier layer between the electrically-conductive liquid coolant and the metal components (substrate and inserts). This glass coating prevents direct contact between the conductive liquid and metal surfaces, eliminating electrochemical reactions and corrosion while allowing efficient thermal energy transfer from the liquid to the metal heat spreader.
3Adaptability or versatility
If a mechanically flexible substrate is used, then mechanical flexibility is improved, but thermal conductivity deteriorates
Solution Approach 1:
The patent overcomes the inherent low thermal conductivity of flexible polymers by embedding high thermal conductivity metal inserts (aluminum or copper) within the flexible substrate. The metal inserts act as thermal highways that conduct heat efficiently from the heat source contact area to the heat sink interface, while the flexible substrate maintains mechanical compliance and flexibility.
4Temperature
If rigid metal inserts are added to improve thermal conductivity, then thermal energy transfer is improved, but device complexity increases
Solution Approach 1:
The patent merges the functions of the flexible substrate, metal inserts, and glass coating into an integrated composite thermal spreader assembly. The metal inserts are embedded within and bonded to the flexible substrate, creating a unified structure that simultaneously provides flexibility, thermal conduction, and corrosion protection without requiring separate components or complex assembly procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced mechanical flexibility, increased thermal conductivity, and reduced thermal resistance, while preventing electrochemical reactions that could lead to corrosion, thus improving heat transfer efficiency and longevity.
Implementation Method 1
the pump being further configured for circulating the electrically-conductive liquid within the internal channel
Implementation Method 2
the thermal spreader being further configured for directing thermal energy from the heat source to the heat sink via the electrically-conductive liquid
Implementation Method 3
said surface of the mechanically flexible substrate being coated with a material such as alkali silicate glass
Implementation Method 4
the rigid metal insert being further configured for promoting thermal energy transfer to the electrically-conductive liquid and for promoting thermal energy transfer from the electrically-conductive liquid
Data Source
AI summary
The present invention is a thermal spreader for providing a high effective thermal conductivity between a heat source and a heat sink. The thermal spreader may include a mechanically flexible substrate. The mechanically flexible substrate may be at least partially constructed of organic materials. The mechanically flexible substrate may form an internal channel which is configured for containing an electrically-conductive liquid. The thermal spreader may further include a pump. The pump may be configured for being connected to the substrate and for circulating the electrically-conductive liquid within the internal channel. The thermal spreader may further include one or more thermally-conductive, rigid metal inserts. Each insert may be configured for being in thermal contact with the electrically-conductive liquid and the substrate and for promoting heat transfer between the thermal spreader and the electrically-conductive liquid.