Flexible Thermoelectric Module with Protruding Connectors
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Solution Overview
Problem
Current flexible thermoelectric devices face challenges in achieving high integration, durability, and large-area applications due to limitations in thermoelectric performance and manufacturing difficulties in mass production.
Innovation Solution
A thermoelectric device and module design featuring a body with protruding connecting parts and electrode extensions that allow for connection between adjacent devices through a matrix of connecting members, enhancing integration and durability while accommodating semiconductor devices within a hollow structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible thermoelectric devices are developed using MEMS processes based on thin films, then flexibility is achieved, but it is difficult to implement large-area devices and mass production failures occur
Solution Approach 1:
The thermoelectric device is divided into multiple independent legs (P-type and N-type) that are arranged in an array. Each leg can be independently manufactured using thin-film MEMS processes, and the modular structure allows scaling to large areas by simply adding more legs in the array configuration.
Solution Approach 2:
The device transitions from two-dimensional thin-film structures to three-dimensional stacked configurations with multiple layers of thermoelectric legs. This vertical stacking enables large-area implementation while maintaining flexibility, as the multi-layer structure can be bent without breaking the thin-film connections.
2Adaptability or versatility
If thermoelectric material legs are made very thin to achieve flexibility, then flexibility is improved, but thermoelectric performance becomes very small
Solution Approach 1:
The thermoelectric legs are configured in multiple vertical layers stacked upon each other. This three-dimensional arrangement increases the total active thermoelectric volume and surface area for heat exchange, thereby enhancing overall thermoelectric performance while each individual leg remains thin for flexibility.
Solution Approach 2:
Multiple P-type and N-type thermoelectric legs are electrically and thermally connected in series and parallel configurations. The combined effect of multiple legs working together produces enhanced thermoelectric performance that compensates for the small output of individual thin legs.
3Reliability
If adjacent thermoelectric devices are connected through connecting members, then durability and integration are improved, but device complexity increases
Solution Approach 1:
The connecting members serve multiple functions simultaneously: they provide mechanical support to hold adjacent thermoelectric devices in position, establish electrical connections between devices, and facilitate thermal management. This multi-functionality reduces the need for separate components, thereby improving durability without proportionally increasing complexity.
Solution Approach 2:
The connecting members integrate structural support, electrical connection, and thermal management functions into a single component. By merging these functions, the overall system complexity is minimized while achieving high durability and integration among adjacent thermoelectric devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the creation of flexible thermoelectric modules with high durability and performance, capable of achieving large-area applications by increasing the degree of integration and improving resistance to external forces.
Implementation Method 1
a device using a Seebeck effect, which is a phenomenon in which electromotive force is generated due to a temperature difference
Implementation Method 2
a device using a Peltier effect, which is a phenomenon in which heat is absorbed or generated by current
Data Source
AI summary
A thermoelectric device is disclosed. The thermoelectric device comprises: a body part comprising a hollow in which a semiconductor device is disposed; a plurality of connecting parts protruding on the lateral sides of the body part and comprising connecting holes; and a plurality of electrode parts connected to the semiconductor device and extending to the connecting holes of the connecting parts.