Flexible Thermoelectric Module Via-Filled Substrate Thermal Resistance
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Solution Overview
Problem
Existing thermoelectric modules face challenges in efficiently converting heat into electrical energy due to mismatched thermal resistance with heat sources, limiting their power generation capability, especially with high-flux heat sources like liquid heat exchangers.
Innovation Solution
A flexible thermoelectric module design featuring a substrate with vias filled with conductive material, where p-type and n-type thermoelectric elements are strategically connected to optimize thermal resistance matching, allowing for efficient heat-to-electricity conversion, including the use of various thermoelectric materials and connectors to enhance energy conversion efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional thermoelectric modules are used, then they can convert heat to electrical energy, but they have mismatched thermal resistance with heat sources which limits power generation capability
Solution Approach 1:
The thermoelectric module is divided into multiple independent thermoelectric elements (both p-type and n-type) arranged in an array on the flexible substrate. Each element can be independently connected to vias through connectors, allowing segmented thermal and electrical pathways that optimize thermal resistance matching with heat sources while maintaining power generation capability
Solution Approach 2:
The patent transitions from traditional rigid three-dimensional module structures to a two-dimensional flexible substrate layout. Thermoelectric elements are disposed on the surface of the flexible substrate and connected through vias, creating a planar configuration that improves thermal contact with heat sources and enables better thermal resistance matching
2Reliability
If thermoelectric elements are connected through vias with conductive material, then electrical connectivity is improved, but device complexity increases
Solution Approach 1:
Multiple electrical connection functions are merged into the flexible substrate structure. The substrate itself serves as both the mechanical support and the electrical connection medium through integrated vias filled with conductive material. Connectors are strategically placed to simultaneously establish electrical connections between adjacent thermoelectric elements and to external circuitry, reducing the number of separate connection components needed
Solution Approach 2:
The flexible substrate with vias acts as an intermediary structure between the thermoelectric elements and external electrical connections. Rather than directly connecting elements to external circuits, the via-filled substrate provides a mediating electrical pathway that simplifies the overall connection architecture while ensuring reliable electrical connectivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible thermoelectric module achieves optimal electrical power conversion by matching thermal resistance with heat sources, effectively generating power from high-flux heat sources, such as liquid heat exchangers, with improved energy conversion efficiency.
Implementation Method 1
thermoelectric power generators have been investigated to utilize temperature gradients for electrical energy generation. Traditionally, the thermoelectric generator has n-type and p-type materials, which create electric potential according to temperature gradients or heat flux through the n-type and p-type materials
Implementation Method 2
The substrate includes a plurality of vias filled with an electrically conductive material
Data Source
Figure 1A
Figure 1B
Figure 1C~1D
AI summary
At least some aspects of the present disclosure direct to a flexible thermoelectric module. The thermoelectric module includes a flexible substrate, a plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements, a first set of connectors, and a second set of connectors. The substrate includes a plurality of vias filled with an electrically conductive material or thermoelectric elements. In some cases, the plurality of p-type thermoelectric elements and the plurality of n-type thermoelectric elements are disposed on the flexible substrate.