Flexible Thermal Interface Material for 3DIC Testing
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Solution Overview
Problem
Three-dimensional integrated circuits (3DICs) face challenges such as high warpage, which leads to gaps between testing apparatus and 3DICs, causing stress concentration and poor heat dissipation.
Innovation Solution
A thermal interface material (TIM) structure is developed, comprising a resilient material with embedded thermal conductive strips and a metal film surrounding the resilient material. This TIM structure conforms to the top surface of the 3DIC, enhances thermal dissipation, and prevents foreign particle attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional testing apparatus is used for 3DICs, then testing can be performed, but gaps form between the apparatus and 3DICs due to high warpage, causing stress concentration and poor heat dissipation
Solution Approach 1:
The patent employs a flexible TIM structure that can deform to conform to the warped surface of the 3DIC. The TIM includes a flexible substrate with through-holes filled with conductive material, allowing it to bend and adapt to the curved surface while maintaining thermal contact. This flexible design eliminates gaps caused by warpage while ensuring continuous thermal pathways for heat dissipation.
Solution Approach 2:
The TIM structure combines multiple materials with complementary properties: a flexible substrate material for mechanical compliance, conductive fill materials (such as metal particles or conductive polymers) for thermal pathways, and protective coatings. This composite construction simultaneously achieves mechanical adaptability to warped surfaces and effective thermal conduction, resolving the contradiction between gap formation and heat dissipation quality.
2Stability of the object's composition
If rigid TIM structure is used, then structural stability is maintained, but it cannot conform to warped 3DIC surfaces, creating gaps and stress concentration
Solution Approach 1:
The TIM structure uses a flexible substrate that can bend and deform to match the warped surface geometry. The flexible nature allows the TIM to conform to curved surfaces while maintaining structural integrity. The through-holes filled with conductive material remain stable and maintain thermal pathways even when the substrate deforms, achieving both adaptability and stability.
Solution Approach 2:
The TIM structure divides the thermal interface into discrete functional elements: a flexible substrate providing mechanical compliance, through-holes creating pathways for conductive material, and the conductive fill providing thermal pathways. This segmentation allows each component to perform its specific function independently, with the substrate providing adaptability and the conductive elements maintaining thermal stability even when deformed.
3Temperature
If thermal conductive material is applied directly to 3DIC surface, then heat dissipation is improved, but foreign particles attach to the material, reducing durability
Solution Approach 1:
The TIM structure uses a flexible substrate with controlled surface properties that resist foreign particle attachment. The substrate acts as a protective barrier between the conductive material and the environment, preventing particle adhesion while maintaining thermal contact. This flexible film approach provides both thermal conductivity and particle resistance, improving durability.
Solution Approach 2:
The flexible substrate serves as an intermediary layer between the conductive material and the external environment. It provides a protective interface that prevents foreign particles from directly contacting and attaching to the conductive material. The substrate mediates between thermal conduction requirements and particle resistance, allowing heat dissipation while protecting the conductive pathways from contamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The TIM structure effectively minimizes the gap between the testing apparatus and 3DICs, reduces stress concentration, and improves heat dissipation, making it durable for multiple testing processes even on highly warped semiconductor structures.
Implementation Method 1
a resilient material to conformally cover the top surface of the tested semiconductor structure
Implementation Method 2
thermal conductive strips are embedded in the resilient material for improving the thermal dissipation
Data Source
AI summary
A semiconductor testing apparatus is provided, and includes a base, a conductive socket, a pusher, and a thermal interface material structure. The conductive socket is disposed in the base for containing a semiconductor structure. The pusher is over the conductive socket and movable in a vertical direction. The thermal interface material structure is connected to the pusher, and includes a resilient material and a metal film around the resilient material. The metal film and the resilient material are in contact with the pusher.