Flexible Tire Sensor Unit Using Segmented Circuit Boards
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Solution Overview
Problem
Existing tire sensor units attached to the inside surface of pneumatic tires are not flexible enough to be durably embedded in the tire structure, leading to detachment or cracking during curing or operation, which shortens their lifespan and limits their ability to accurately monitor specific structural parameters like belt edge temperatures.
Innovation Solution
A flexible sensor unit composed of individual circuit boards with electrically conductive connecting ribbons, including a radio frequency identification integrated circuit, microcontroller unit, sensors, power source, and boost converter, which can be permanently embedded in the tire structure without damaging it, allowing for accurate temperature and other parameter monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single substrate integrated sensor unit is used, then sensor functionality can be increased, but the sensor unit becomes rigid and detaches or cracks during curing or operation
Solution Approach 1:
The sensor unit is divided into multiple individual circuit boards (first circuit board with RFID IC, second circuit board with microcontroller and sensor, third circuit board with power source and boost converter) connected by flexible ribbons, allowing each board to flex independently while maintaining electrical connections, thus preventing cracking and detachment during tire curing and operation
2Measurement precision
If sensor size is increased to collect more data and monitor parameters with greater sensitivity, then measurement precision is improved, but device complexity and rigidity increase, making embedding difficult
Solution Approach 1:
Complex sensor functionality is distributed across multiple specialized circuit boards rather than integrating all components on a single large substrate. Each board handles specific functions (RFID, sensing, power management), reducing individual board complexity while maintaining overall system capability through modular architecture with flexible ribbon interconnections
3Use of energy by moving object
If power-related component size is increased to meet increased power requirements for monitoring and transmission, then energy availability is improved, but device complexity and rigidity increase
Solution Approach 1:
Power management components (power source and boost converter) are separated onto their own dedicated circuit board, isolating the complex power-related components from other sensor functions. This modular approach allows adequate power component sizing for energy requirements while maintaining overall system flexibility through the distributed architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible sensor unit maintains the durability of both the tire and the sensor, enabling increased sensor functionality and reliable monitoring of tire performance, including predicting potential thermal damage and recommending timely replacements.
Implementation Method 1
An antenna for receiving and transmitting a signal to an external reader is also electronically connected to the integrated circuit
Data Source
AI summary
A flexible sensor unit is embedded in a tire. The flexible sensor unit includes a plurality of individual circuit boards. Each circuit board includes at least one electronic component. The at least one electronic component includes a radio frequency identification integrated circuit, a microcontroller unit, at least one sensor, a power source and a boost converter. Each one of a plurality of electrically conductive flexible connecting ribbons extends between the circuit boards. An end ribbon is electrically connected to at least one of the circuit boards. An antenna is disposed on the end ribbon. The antenna transmits data from the at least one sensor, as processed by the microcontroller unit, and identification data from the radio frequency identification integrated circuit, to an external reader.