Flexible Top Plate for Uniform Dielectric Interstitial Layer

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Solution Overview

Problem

High-density piezoelectric ink jet print heads face challenges in achieving uniform interstitial layer thickness, leading to ink communication issues and increased production time due to non-uniform etch times and potential ink leaks, which affect printing resolution and efficiency.

Innovation Solution

A method involving a flexible top plate and mold release is used to apply pressure and cure the dielectric interstitial layer uniformly over an array of piezoelectric elements, ensuring consistent thickness and improving ink communication within the print head.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a rigid top plate is used to apply pressure to the uncured dielectric interstitial layer, then the pressure application is straightforward, but the interstitial layer thickness becomes non-uniform due to the rigid plate not conforming to surface variations

Engineering Contradiction:

Improveinterstitial layer thickness uniformityVSAvoidpressing mechanism complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent employs a flexible top plate instead of a rigid one to apply pressure during interstitial layer formation. This flexible plate conforms to the underlying surface variations (piezoelectric element topography) while maintaining uniform pressure distribution, thereby achieving uniform interstitial layer thickness without requiring complex positioning mechanisms.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent changes the physical parameter of the top plate from rigid to flexible, allowing it to adapt its shape to the underlying structure while maintaining contact. This parameter change enables the plate to conform to surface variations and produce uniform thickness in the interstitial layer.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If pressure is applied to the uncured dielectric interstitial layer without a flexible top plate, then the process is simpler, but the interstitial layer thickness varies leading to ink communication problems and leaks

Engineering Contradiction:

Improveink communication reliabilityVSAvoidinterstitial layer thickness uniformity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The flexible top plate acts as an intermediary that distributes pressure uniformly across the uncured dielectric interstitial layer while conforming to the underlying piezoelectric element topography. This ensures consistent thickness throughout the layer, preventing ink communication issues and leaks that would arise from thickness variations.

Inventive Principle:

Principle #30Flexible shells and thin films

3Manufacturing precision

If the interstitial layer is made uniformly thick, then ink communication and leak issues are reduced, but the curing process requires more precise pressure control and longer time

Engineering Contradiction:

Improveinterstitial layer thickness uniformityVSAvoidcuring time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The flexible top plate is positioned and prepared before the uncured dielectric interstitial layer is applied. This preliminary setup ensures that when pressure is applied during curing, the flexible plate is already in the correct position to distribute pressure uniformly, eliminating the need for repeated adjustments and reducing overall curing time while maintaining thickness uniformity.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The approach results in a more uniform interstitial layer thickness, reducing ink communication problems and ink leaks, thereby enhancing printing resolution and production efficiency by maintaining consistent etch times and improving the overall performance of the ink jet print head.

Implementation Method 1

a flexible top plate (72) comprising at least one of glass, silicon, quartz, sapphire, and metal... wherein the flexible top plate flexes during the application of pressure to the uncured dielectric interstitial layer

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

curing the dielectric interstitial layer while maintaining contact between the uncured dielectric interstitial layer and the mold release and applying the pressure to the uncured dielectric interstitial layer

Methodology Applied

Scientific EffectCuring:

Data Source

PatentUS8556611B2Method for interstitial polymer planarization using a flexible flat plate

Publication Date: 2013.10.15 XEROX CORP

AI summary

A method and structure for forming an ink jet print head having a dielectric interstitial layer. A flexible top plate attached to a press can be used to apply pressure to an uncured dielectric interstitial layer. The uncured dielectric interstitial layer is cured while contacting the uncured dielectric interstitial layer with the flexible top plate and applying pressure using the press. Using a flexible top plate rather than a rigid top plate has been found to form a cured interstitial layer over an array of piezoelectric elements which has a more uniform or planar upper surface. An interstitial layer so formed can result in decreased processing time, reduced problems with ink communication in the ink jet print head during use, and decreased manufacturing costs.