Flexible Touch Panel Conductive Bridge Segmentation

The single via hole connection is segmented into multiple via holes (first via hole and second via hole) that connect the conductive bridge to the touch electrode at different positions. This segmentation increases the contact area between the conductive bridge and touch electrode, thereby reducing contact resistance while maintaining structural simplicity through the systematic arrangement of multiple connection points.

The single conductive bridge is segmented into multiple conductive bridges (first conductive bridge and second conductive bridge) that connect adjacent touch electrodes. Each conductive bridge spans different portions of the gap between electrodes, distributing the bending stress across multiple structures. This segmentation reduces stress concentration on any single bridge, lowering the risk of wire breakage during bending while maintaining overall structural simplicity.

The patent employs a composite material structure where the conductive bridge is formed using a material composition that balances optical transparency with mechanical flexibility. The conductive bridge material is designed to maintain good light transmittance properties similar to ITO while incorporating characteristics that improve bending resistance, achieving a composite solution that resolves the contradiction between optical performance and mechanical durability.

The patent applies local quality by using different material compositions in different regions of the touch panel structure. The conductive bridge uses a material formulation optimized for bending resistance in regions subject to mechanical stress, while maintaining transparency in regions requiring optical performance. This localized material optimization allows the structure to achieve both improved bending resistance and adequate light transmittance without uniformly compromising either property across the entire wire structure.