Flexible Touch Panel Conductive Member with Interlayer Insulation
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Solution Overview
Problem
When a flexible substrate is used as the transparent insulating substrate in touch panels, the conductive layer formed of opaque conductive materials like metal can be damaged during manufacturing, leading to functional issues and poor storage stability.
Innovation Solution
A method involving a conductive member with a first and second mesh conductive layer, and an interlayer insulating layer of 1 to 5 μm thickness on a flexible transparent substrate, where the interlayer insulating layer is formed using a polymer derived from compounds with acryloyl or methacryloyl groups, and the conductive layers are patterned using photolithography, ensuring bend resistance and storage stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If a flexible substrate is used as the transparent insulating substrate to reduce weight and secure flexibility, then weight is reduced and flexibility is improved, but the conductive layer formed of opaque conductive material may be damaged during manufacturing
Solution Approach 1:
An interlayer insulating layer is introduced as an intermediary between the flexible substrate and the conductive layer. This intermediate layer serves as a protective buffer that prevents direct contact and mechanical damage to the conductive layer during manufacturing and usage, while still allowing the flexible substrate to provide weight reduction and flexibility benefits.
Solution Approach 2:
The interlayer insulating layer is positioned beforehand between the flexible substrate and the conductive layer to provide cushioning protection. This pre-positioned protective layer absorbs mechanical stresses and prevents damage to the conductive layer before damage can occur, ensuring reliability while maintaining the flexible substrate's advantages.
2Weight of moving object
If a flexible substrate is used to reduce weight and secure flexibility, then weight is reduced and flexibility is improved, but storage stability deteriorates
Solution Approach 1:
The interlayer insulating layer acts as a protective intermediary that isolates the conductive layer from the flexible substrate's environmental influences. This intermediate barrier prevents moisture and oxygen from reaching the conductive layer, thereby maintaining storage stability while allowing the flexible substrate to provide weight reduction.
Solution Approach 2:
The interlayer insulating layer creates a protected environment for the conductive layer, effectively isolating it from harmful external factors. This protective barrier maintains a stable environment for the conductive layer during storage, preventing degradation while allowing the overall device to remain flexible and lightweight.
3Ease of manufacture
If opaque conductive material is used for the conductive layer, then patterning is easier and resistance is lower, but damage to the conductive layer occurs during manufacturing
Solution Approach 1:
The interlayer insulating layer is introduced as a protective intermediary between the manufacturing process and the conductive layer. This intermediate layer protects the opaque conductive material from mechanical damage during patterning and manufacturing operations, allowing the benefits of opaque materials (easier patterning, lower resistance) to be achieved without compromising integrity.
Solution Approach 2:
The interlayer insulating layer is positioned beforehand to provide cushioning protection to the conductive layer during manufacturing. This pre-positioned protective layer absorbs mechanical stresses and prevents damage to the opaque conductive material during patterning processes, ensuring reliability while maintaining manufacturing ease.
4Ease of operation
If the interlayer insulating layer thickness is reduced to improve flexibility, then flexibility is improved, but interlayer insulating properties deteriorate
Solution Approach 1:
The thickness of the interlayer insulating layer is optimized to a specific parameter range (1 to 5 μm) that balances two competing requirements: thin enough to maintain flexibility and allow bending, yet thick enough to provide adequate electrical insulation. This parameter optimization resolves the contradiction between flexibility and insulating properties.
Solution Approach 2:
The interlayer insulating layer is designed with specific local properties appropriate for its function. By selecting materials and thickness within the optimized range, the layer provides sufficient insulation where needed while maintaining overall flexibility. The local quality of the insulating layer is tailored to balance electrical insulation requirements with mechanical flexibility requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents damage to the conductive layer and ensures excellent storage stability and interlayer insulating properties, even with flexible substrates, by maintaining the integrity of the conductive layers and maintaining low electrical resistance.
Implementation Method 1
each of a step of forming the first conductive layer and a step of forming the second conductive layer includes a step of forming a fine metal wire using a photolithography method
Data Source
AI summary
Provided are a conductive member for a touch panel and a manufacturing method thereof, the conductive member having a conductive layer including an opaque conductive material on a flexible transparent insulating substrate, such that damage of the conductive layer is prevented. The manufacturing method of the conductive member including a first conductive layer, an interlayer insulating layer, and a second conductive layer in this order on the flexible substrate, includes: 1) forming the first conductive layer on the substrate; 2) forming the interlayer insulating layer; and 3) forming the second conductive layer, in which each of the steps 1 and 3 includes forming a fine metal wire using a photolithography method, a thickness of the interlayer insulating layer is 1 to 5 μm, and the bend resistance obtained by measuring the conductive member using a cylindrical mandrel method according to JIS-K5600-5-1 is less than 5 mm.