Flexible two-phase cooling system
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Solution Overview
Problem
Conventional cooling systems for data centers and electronic devices are inefficient and costly, particularly in managing high heat fluxes from next-generation microprocessors, due to limitations in air cooling and liquid cooling systems, which face challenges with thermal resistance, material costs, and the risk of water leaks.
Innovation Solution
A flexible two-phase cooling system with a primary cooling loop, bypasses, and heat exchangers using dielectric coolants, which circulates low-pressure coolant through flexible lines and heat sink modules with orifices to deliver jet streams for efficient heat transfer, allowing for compact and efficient cooling within server housings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling systems are used with high flow rates to cool high heat flux devices, then cooling effectiveness is improved, but system size and power consumption increase significantly
Solution Approach 1:
The patent employs two-phase dielectric coolant that undergoes phase change (evaporation and condensation) to transfer heat. The coolant evaporates at the heat sink absorbing latent heat, then condenses in the heat exchanger releasing latent heat, providing highly efficient cooling with much lower power consumption than air cooling systems
Solution Approach 2:
The system uses liquid dielectric coolant circulation through flexible cooling lines instead of air flow. The liquid coolant system with pump-driven circulation provides superior heat transfer efficiency compared to air cooling, reducing the power needed for cooling while effectively managing high heat fluxes
2Temperature
If liquid cooling systems with water are used to improve heat transfer efficiency, then cooling performance is improved, but risk of water leaks and damage increases
Solution Approach 1:
The patent changes the chemical properties of the coolant from water to dielectric coolant. This parameter change maintains the liquid phase and high heat transfer efficiency while fundamentally altering the electrical properties to be non-conductive and non-corrosive, eliminating the hazards associated with water leaks to electronic components
Solution Approach 2:
The system uses dielectric coolant which can be considered a composite or specially formulated liquid material that combines the desirable thermal properties of water (high specific heat, good thermal conductivity) with electrical insulation properties, creating a coolant that is both thermally efficient and safe for use with electronic devices
3Stability of the object's composition
If rigid cooling lines are used to transport coolant, then structural stability is improved, but flexibility for routing within server housings is reduced
Solution Approach 1:
The patent uses flexible cooling lines instead of rigid piping to transport dielectric coolant. These flexible lines can be routed through the confined spaces of server housings and around various components while maintaining structural integrity and coolant containment, providing both flexibility for installation and stability for operation
4Productivity
If high pressure coolant flow is used to increase cooling capacity, then heat removal rate is improved, but risk of leaks and system failure increases
Solution Approach 1:
The system operates with low-pressure coolant flow by utilizing the natural circulation properties of the two-phase dielectric coolant and appropriately sized piping. This parameter change from high to low pressure maintains adequate heat removal capacity while significantly reducing the stress on system components and joints, thereby improving reliability and reducing leak risk
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides significant reductions in power consumption and heat transfer rates, enabling effective cooling of high heat flux devices while minimizing physical footprint and risk of damage, thus overcoming the inefficiencies of traditional cooling methods.
Implementation Method 1
two-phase cooling system
Implementation Method 2
efficient heat transfer
Implementation Method 3
heat sink modules with orifices to deliver jet streams
Implementation Method 4
jet streams for efficient heat transfer
Implementation Method 5
heat exchangers using dielectric coolants
Data Source
AI summary
A flexible two-phase cooling apparatus for cooling microprocessors in servers can include a primary cooling loop, a first bypass, and a second bypass. The primary cooling loop can include a reservoir, a pump, an inlet manifold, an outlet manifold, and flexible cooling lines extending from the inlet manifold to the outlet manifold. The flexible cooling lines can be routable within server housings and can be fluidly connected to two or more series-connected heat sink modules that are mountable on microprocessors of the servers. The flexible cooling lines can be configured to transport low-pressure, two-phase dielectric coolant. The first bypass can include a first pressure regulator configured to regulate a first bypass flow of coolant through the first bypass. The second bypass can include a second pressure regulator configured to regulate a second bypass flow of coolant through the second bypass.