Flexible Vacuum Detachment of Semiconductor Layers Without Breakage
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Solution Overview
Problem
Existing methods for detaching semiconductor layers from substrates are complex, error-prone, and require significant space, leading to material loss and risk of breakage during the detachment process in industrial production.
Innovation Solution
A detachment element with a flexible contact wall and movable supports, using vacuum suction and actuators to apply detachment forces without moving the element relative to the substrate, allowing for a space-saving and robust structure with controlled detachment movements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a removal roller with large radius of curvature is used to reduce breakage risk, then the risk of breakage is reduced, but the overall space requirement increases due to complex guide system
Solution Approach 1:
The removal roller is segmented into multiple smaller rollers arranged in series, each with a smaller radius of curvature. This segmentation allows the use of compact rollers while distributing the detachment force across multiple contact points, maintaining reliability while reducing the space required for guide systems.
Solution Approach 2:
The invention transitions from a single large-radius roller to multiple small-radius rollers arranged in a linear sequence. This dimensional reorganization allows the system to achieve the same detachment function with significantly reduced footprint, as the rollers are arranged along a line rather than requiring a large curved path.
2Ease of operation
If manual positioning of suction element is used to detach semiconductor layer, then detachment can be achieved, but the method is too complex and error-prone for industrial production
Solution Approach 1:
The suction element is designed to automatically position itself on the semiconductor layer through vacuum attraction, eliminating the need for manual positioning. The system self-regulates the detachment process by maintaining consistent suction force, reducing operational complexity and error rates in industrial production.
Solution Approach 2:
Manual mechanical positioning is replaced with a vacuum-based positioning system. The suction element uses pressure differential (vacuum) to automatically adhere to and position itself on the semiconductor layer, replacing complex manual mechanical operations with a simpler pneumatic system.
3Productivity
If sawing method is used to create semiconductor substrates from block, then substrate production is achieved, but significant material loss occurs
Solution Approach 1:
The invention extracts the semiconductor layer from the substrate using a porous separating layer that allows selective removal. The porous structure enables the semiconductor layer to be detached intact through vacuum suction, extracting the desired product without the material waste associated with sawing and repositioning operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient, space-saving, and controlled detachment of semiconductor layers with reduced risk of breakage, facilitating industrial-scale production by applying detachment forces through movable supports and actuators, ensuring precise movement and force distribution.
Implementation Method 1
at least one vacuum chamber with at least one extraction opening and at least one air-permeable intake area for drawing in the semiconductor layer
Data Source
Figure 1~2
Figure 3a)~3c)
Figure 4a)~4b)
AI summary
The invention relates to a release element for releasing a semiconductor layer from a substrate, having at least one negative-pressure chamber with at least one suction-extraction opening and at least one air-permeable suction-attachment region for suction attachment of the semiconductor layer. The invention is characterized in that the negative-pressure chamber has a flexible contact wall for placing against the semiconductor layer and the suction-attachment region is formed in the contact wall, and in that the release element has a plurality of spaced-apart supports and one or more actuators, wherein the supports lie with the ends that are facing the contact wall against the contact wall and can be moved by means of the actuator or the actuators and are formed so as to interact with the contact wall in order to move the contact wall, at least in some regions.