Flexible Vapor Chamber with Thin-Film Enclosures for Foldable Electronics
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Solution Overview
Problem
Existing thin vapor chambers with rigid materials are inflexible and cannot accommodate the bending and deformation required by foldable electronic devices, limiting their placement and impacting space efficiency and configuration in portable electronic devices.
Innovation Solution
A flexible vapor chamber composed of two flexible enclosures with a wick structure, each made of layered metal and polymer films, allowing for flexible bending and deformation, enabling placement in both foldable and non-foldable regions of electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rigid materials are used for the base and cover plates of the vapor chamber, then the heat dissipation performance is improved, but the flexibility and adaptability to foldable structures deteriorates
Solution Approach 1:
The base plate and cover plate are constructed using flexible materials including a heat-conducting film, polymer film, and outer film. The heat-conducting film replaces traditional rigid metal plates, providing both thermal conductivity and flexibility. The polymer film sandwiched between metal films maintains structural integrity while enabling bending and deformation required for foldable electronic devices.
Solution Approach 2:
The vapor chamber employs a composite multi-layer structure consisting of heat-conducting film, polymer film, and outer film. This composite construction combines the thermal conductivity benefits of metal-like materials with the flexibility of polymer materials, achieving both effective heat dissipation and adaptability to foldable configurations.
2Productivity
If rigid vapor chambers are used in electronic devices, then the heat dissipation efficiency is improved, but the space efficiency and configuration flexibility in foldable devices deteriorates
Solution Approach 1:
The flexible vapor chamber can be conformally attached to heat-generating components in both folded and unfolded states, maximizing contact area and heat dissipation efficiency regardless of device configuration. The thin-film construction allows the vapor chamber to adapt to varying spatial requirements without compromising thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible vapor chamber optimizes space utilization and configuration efficiency by allowing heat-sensitive components to be positioned flexibly within foldable electronic devices, ensuring effective heat dissipation and stable operating temperatures.
Implementation Method 1
with the phase change that occurs as the working fluid absorbs and dissipates heat, enables rapid and substantial heat absorption
Implementation Method 2
the working fluid serves the purpose of absorbing and dissipating heat
Implementation Method 3
the wick structure guides the flow of the working fluid
Data Source
AI summary
Disclosed is a flexible vapor chamber having two flexible enclosures and a wick structure. A chamber is formed between the flexible enclosures, which accommodates a working fluid designed to absorb and dissipate heat. In addition, the wick structure is disposed within the chamber. Each of the flexible enclosures has a flexible section and two extensions in a length direction, and each of the flexible sections is located between the extensions that constitute the flexible enclosures and extends to both opposite sides of the flexible enclosures in a width direction. The thickness of each flexible section is thinner than that of each adjacent extension, and the design allows each flexible enclosure to be flexibly bent in a direction of its thickness.