Flexible Vapor Chamber Dot-Matrix Wick for Thin Heat Spreading
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Solution Overview
Problem
Current flexible vapor chambers for electronic devices are thick, heavy, have low thermal conductivity, high thermal resistance, and high energy consumption, leading to shortened service life and poor user experience.
Innovation Solution
An ultra-thin flexible vapor chamber is prepared using projection micro stereolithography (PμSL) technology to create a micro-scale dot matrix array structure with optimized distribution, featuring flexible substrates like FPCB, graphene, and copper foil, and includes chemical and electroplating treatments to enhance thermal conductivity and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible porous materials such as porous plastics, porous polymers, foam metals, and multi-layer woven wire meshes are used for capillary wick structures, then the vapor chamber can be made flexible, but the vapor chamber becomes thick and heavy with low thermal conductivity and high thermal resistance
Solution Approach 1:
The patent uses a porous layer made of porous material (such as porous polymer, porous metal, or porous ceramic) as the capillary wick structure. This porous layer is integrated with the vaporization chamber body to enable liquid transport through capillary action while maintaining a thin and lightweight design. The porous structure provides both flexibility and improved thermal conductivity compared to traditional flexible vapor chambers, resolving the contradiction between flexibility and thermal performance.
2Ease of manufacture
If traditional capillary wick structures are used, then the vapor chamber can be assembled, but the thermal resistance is high and energy consumption is high, shortening service life
Solution Approach 1:
The patent merges the porous layer with the vaporization chamber body into an integrated structure. The porous layer is formed as part of the vaporization chamber assembly process, eliminating the need for separate assembly steps. This integration reduces assembly complexity while improving thermal efficiency by reducing thermal resistance at interfaces, thereby lowering energy consumption and extending service life.
3Length of stationary object
If the vapor chamber thickness is reduced to meet electronic device requirements, then the device can be thinner, but the structural strength and liquid transport capability may be compromised
Solution Approach 1:
The patent applies local quality by creating a porous layer with specific local properties within the vaporization chamber structure. The porous layer is positioned at the liquid supply interface where it is needed for capillary action, while the rest of the vaporization chamber maintains its structural integrity. This localized approach enables thinness overall while providing sufficient structural strength and liquid transport capability where required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ultra-thin vapor chamber provides stronger thermal conductivity, less thermal resistance, and reduced energy consumption, improving heat dissipation and extending the service life of electronic devices.
Implementation Method 1
The dot matrix array structure has capillary suction properties and strength characteristics, and plays a key role in absorbing and transporting liquid
Implementation Method 2
printing a dot matrix array structure on one side of the lower cover plate using a PμSL device
Implementation Method 3
chemical and electroplating treatments to enhance thermal conductivity and flexibility
Implementation Method 4
chemical and electroplating treatments to enhance thermal conductivity and flexibility
Data Source
AI summary
An ultra-thin flexible vapor chamber and a preparation method and application thereof are provided. Based on projection micro stereolithography technology, the preparation method of the present disclosure enables preparation of the ultra-thin flexible vapor chamber of a micro-scale and high-precision ultra-thin dot matrix array structure with excellent liquid absorption and support capabilities. To improve properties of the vapor chamber, various dot matrix array structures including but not limited to a star-shaped array structure, a radial array structure and a parallel array structure, can be designed by topologically optimizing a distribution of the dot matrix array structure according to a location of a heat source. The ultra-thin flexible vapor chamber prepared herein not only meets requirements of an electronic device for a vapor chamber thickness and weight, but also features flexibility and bendability, stronger thermal conductivity, less thermal resistance and less energy consumption.