Flexible Wafer Support Plate for Thermal Expansion During Rotation

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Solution Overview

Problem

Existing thermal processing systems for semiconductor wafers suffer from mechanical damage to the workpiece backside due to rigid pin supports, which cause scratches and imprints during heat cycles due to thermal expansion and contraction.

Innovation Solution

A support structure with a rotatable support plate, where the support structure is more flexible in the radial direction than in the azimuthal direction, allowing it to yield to thermal expansion while maintaining rigidity for workpiece rotation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If rigid pin supports are used to support the workpiece, then the workpiece can be held securely during thermal processing, but mechanical damage such as scratches and imprints occur on the workpiece backside due to thermal expansion and contraction

Engineering Contradiction:

Improveworkpiece support stabilityVSAvoidmechanical damage to workpiece backside

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies this principle by using a flexible support structure with controlled flexibility characteristics. The support structure includes a flexible layer that can deform to accommodate thermal expansion and contraction of the workpiece, preventing mechanical damage while maintaining support stability. The flexible layer is designed with specific mechanical properties to allow radial expansion/contraction while maintaining azimuthal rigidity for rotational stability.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent applies this principle by changing the mechanical parameters of the support structure, specifically its flexibility characteristics in different directions. The support structure is designed with anisotropic flexibility - more flexible in the radial direction to accommodate thermal expansion, and less flexible in the azimuthal direction to maintain rotational stability. This directional parameter change resolves the contradiction between support stability and mechanical damage prevention.

Inventive Principle:

Principle #35Parameter changes

2Object-affected harmful factors

If the support structure is made flexible to accommodate thermal expansion, then mechanical damage is reduced, but the ability to transfer rotational momentum may be compromised

Engineering Contradiction:

Improvemechanical damage reductionVSAvoidrotational momentum transfer capability

Core Design Contradiction:

Object-affected harmful factorsVSStrength

Solution Approach 1:

The patent applies this principle by creating a support structure with non-uniform flexibility distribution. The flexible layer has different mechanical properties in different locations and directions - it is more flexible in the radial direction to reduce mechanical damage from thermal expansion, while maintaining sufficient rigidity in the azimuthal direction to transfer rotational momentum effectively. This local quality differentiation resolves the contradiction between damage reduction and rotational capability.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent applies this principle by designing an asymmetric support structure with directional flexibility characteristics. The support structure is engineered to have different stiffness values in radial versus azimuthal directions, creating an asymmetric mechanical response that allows thermal expansion accommodation while preserving rotational momentum transfer. This asymmetry in mechanical properties directly addresses the contradiction between flexibility and rotational strength.

Inventive Principle:

Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The flexible support structure reduces mechanical damage to the workpiece backside by accommodating thermal expansion and contraction, while maintaining the ability to transfer rotational momentum, thus minimizing scratches and imprints.

Implementation Method 1

the support structure has a flexibility in a radial direction of the rotatable support plate that is greater than a flexibility in an azimuthal direction of the rotatable support plate... accommodating thermal expansion and contraction

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS20250096032A1Support Structure for Thermal Processing Systems

Publication Date: 2025.03.20 MATTSON TECHNOLOGY INC

AI summary

Support plates and support structures for thermal processing systems to heat workpieces are provided. In one example, a thermal processing apparatus is provided that includes a plurality of heat sources, a rotatable support plate, and a support structure having a flexibility in the radial direction of the rotatable support plate that is greater than a flexibility in the azimuthal direction of the rotatable support plate. Also provided are support plates for supporting a workpiece in a thermal processing apparatus. The support plate can include a base defining a radial direction and an azimuthal direction and at least one support structure extending from the base having a flexibility in the radial direction of the base that is greater than a flexibility in the azimuthal direction of the base.