Flexible Waveguide Interconnect for RF Noise Immunity

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Portable devices face data corruption due to RF noise interference with low amplitude electrical signals during high bandwidth applications like streaming video, as they often require expensive and bulky optical connectors for efficient data transfer.

Innovation Solution

A flex interconnect with an integrated optical waveguide and electrical-to-optical and optical-to-electrical interfaces on a flexible printed circuit substrate, allowing for the transmission and reception of both electrical and optical signals without the need for expensive optical connectors, using polymer waveguides or other optically transparent materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If electrical wires are used for high bandwidth data transmission, then data transfer rate is improved, but data corruption occurs due to RF noise interference

Engineering Contradiction:
Improvedata transfer rateVSAvoidsignal integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent replaces electrical signal transmission through wires with optical signal transmission through waveguides. The optical transport layer uses light signals instead of electrical signals to transmit data, which are immune to RF noise interference. This substitution resolves the contradiction by maintaining high data transfer rates while eliminating signal corruption from RF noise.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces an optical transport layer as an intermediary between electrical components. Electrical-to-optical converters transform electrical signals into optical signals for transmission through the waveguide, and optical-to-electrical converters transform them back at the destination. This intermediary optical layer protects against RF noise while enabling high bandwidth transmission.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If optical connectors are used for noise-free data transmission, then immunity to RF noise is improved, but device complexity and cost increase due to bulky connectors

Engineering Contradiction:
Improveimmunity to RF noiseVSAvoidconnector complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the optical transport function directly into the flexible printed circuit board substrate. The waveguide is integrated within the substrate layers, and the electrical-to-optical and optical-to-electrical converters are mounted on the substrate itself. This integration eliminates the need for separate optical connectors, reducing device complexity while maintaining noise immunity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The flexible printed circuit board substrate serves multiple functions: it provides mechanical support, contains electrical interconnects for power and control signals, and integrates the optical waveguide for data transmission. This multi-functionality eliminates the need for separate optical connectors while maintaining the benefits of optical transmission.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Productivity

If optical connectors are used for high speed data transmission, then data transfer rate is improved, but weight and volume increase

Engineering Contradiction:
Improvedata transfer rateVSAvoidinterconnect weight
Core Design Contradiction:
ProductivityVSWeight of moving object

Solution Approach 1:

The patent combines the optical waveguide, electrical interconnects, and converter components into a single integrated flexible printed circuit board assembly. This integration eliminates the need for separate optical connectors and their associated mounting hardware, significantly reducing the overall weight of the interconnect system while maintaining high data transfer rates.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent uses a flexible printed circuit board substrate with integrated waveguides that can be bent and conform to device contours. This flexible integration approach eliminates rigid optical connectors and their heavy mounting structures, reducing weight while enabling high-speed optical data transmission in portable devices.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively transmits high-speed data without data corruption from RF noise, reducing the need for bulky connectors and enhancing data transfer rates in portable devices like cell phones and laptops.

Implementation Method 1

The optical waveguide includes an integral optical transport layer, including electrical-to-optical and optical-to-electrical interfaces connected at either end of the optical waveguide

Methodology Applied
Scientific EffectOptical waveguide: Waveguide (optics)

Implementation Method 2

The optical waveguide includes an integral optical transport layer, including electrical-to-optical and optical-to-electrical interfaces

Methodology Applied
Scientific EffectElectrical-to-optical conversion:

Implementation Method 3

The optical waveguide includes an integral optical transport layer, including electrical-to-optical and optical-to-electrical interfaces

Methodology Applied
Scientific EffectOptical-to-electrical conversion:

Data Source

PatentUS7627204B1Optical-electrical flex interconnect using a flexible waveguide and flexible printed circuit board substrate
Publication Date: 2009.12.01 NAT SEMICON CORP
  • US7627204B1 patent drawing
  • US7627204B1 patent drawing
  • US7627204B1 patent drawing

AI summary

A flex interconnect with an integrated electrical-to optical and optical-to-electrical transport layer, which enables the optical transport of critical high speed data without the need of expensive and bulky optical connectors. The flex interconnect assembly includes a flexible printed circuit substrate, which includes one or more electrical interconnects, formed on the flexible printed circuit substrate, for transmitting one or more electrical signals respectively. The flexible printed circuit substrate also includes an optical waveguide mounted onto the substrate. The optical waveguide includes an integral optical transport layer, including electrical-to-optical and optical-to-electrical interfaces connected at either end of the optical waveguide. With the integrated optical transport layer, the flex interconnect can receive electrical signals, convert and transmit them to optical signals, and then convert them back to electrical signals, all without expensive and bulky opto-electrical connectors. In one embodiment, the flex interconnect is used for transmitting both electrical and optical signals in a portable device, such as a cell phone, PDA, personal computer, and the like.