Flexible Wearable Electronics Bonding Segmentation
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Solution Overview
Problem
Flexible portable electronic devices, such as wristwatches, face issues with warping or delamination when subjected to high bending angles due to insufficient elasticity and shear stress resistance in their electronic components, which are typically bonded over their entire surface.
Innovation Solution
The device features an electronic assembly where components are mechanically held to each other or the flexible bands on only one portion of their surface, allowing for elastic deformation and increased winding angle, reducing the risk of warping and delamination by minimizing the connected surface area and using resilient connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If electronic components are bonded over their entire surface, then mechanical strength and connection homogeneity are improved, but the device is prone to warping and delamination when subjected to high bending angles
Solution Approach 1:
The bonding area of electronic components is segmented into discrete localized zones rather than continuous full-surface bonding. This segmentation allows different parts of the component to have different degrees of freedom, enabling the device to bend without creating stress concentration points that would cause warping or delamination.
Solution Approach 2:
Different regions of the electronic components have different bonding characteristics - areas requiring stability are locally bonded, while areas requiring flexibility remain unbonded. This local differentiation of bonding quality allows the device to maintain structural integrity at bond points while permitting necessary deformation in unbonded regions during high-angle bending.
2Stability of the object's composition
If electronic components are rigidly fixed to maintain structural stability, then mechanical resistance is improved, but the device cannot accommodate high bending angles without warping
Solution Approach 1:
The bonding system transitions from a static rigid connection to a dynamic semi-rigid connection. The localized bonding points provide structural stability when needed, while the unbonded regions allow dynamic adjustment and relative movement during bending, enabling the device to adapt to high bending angles without warping.
Solution Approach 2:
The bonding parameters are changed from full-surface continuous bonding to localized discrete bonding. This parameter change reduces the overall constraint on the electronic components, allowing them to change shape and accommodate bending while maintaining sufficient structural stability through the localized bond points.
3Ease of operation
If the radius of curvature is reduced to enable winding around body parts, then portability and wearability are improved, but the shear stress on bonds increases leading to delamination
Solution Approach 1:
The bond structure is segmented into multiple localized points distributed across the component surface. This segmentation distributes the shear stress generated during bending across multiple discrete locations rather than concentrating it across the entire bond interface, reducing the stress burden on each individual bond point and preventing delamination during high-curvature winding.
4Strength
If electronic components are fully bonded to the flexible body, then mechanical resistance is improved, but elastic deformation capability is reduced
Solution Approach 1:
Instead of applying full-surface bonding (excessive action), the invention applies partial bonding only at specific localized points. This partial bonding provides sufficient mechanical resistance at critical locations while leaving enough unbonded areas to allow the electronic components to undergo elastic deformation and relative movement during high-angle bending without delamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the electronic components to maintain their ability to deform elastically, absorb bending stresses, and slide relative to each other, effectively preventing warping and delamination, even at low radii of curvature.
Implementation Method 1
the resilient connector. As a result of these features, the present invention provides a flexible portable electronic device wherein the electronic components for processing information are mechanically held to each other or to one of the upper or lower flexible bands
Data Source
AI summary
Flexible portable electronic device capable of elaborating information, including a flexible body arranged to be capable of being secured to a part of the user's body, the flexible body including a lower flexible band and an upper flexible band. The flexible portable electronic device includes an electronic assembly for processing information, the electronic assembly for processing information including at least a first electronic component with a substantially flat surface, housed between the upper flexible band and the lower flexible band of the flexible body. The first electronic component is secured on only one portion of the surface thereof to one of the upper or lower flexible bands.